公开(公告)号：US20230197803A1

公开(公告)日：2023-06-22

申请号：US17851857

申请日：2022-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Wook PARK ,  Yun Kyoung SONG ,  Bong Keun KIM ,  Se Jin PARK

IPC: H01L29/417 ,  H01L27/088 ,  H01L29/06 ,  H01L29/08 ,  H01L29/423 ,  H01L29/786 ,  H01L29/775

CPC classification number: H01L29/41775 ,  H01L27/088 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/42392 ,  H01L29/41733 ,  H01L29/78696 ,  H01L29/775

Abstract: A semiconductor device includes a first active pattern that extends in a first horizontal direction, a second active pattern which extends in the first horizontal direction, and is spaced apart from the first active pattern by a first distance in a second horizontal direction, a third active pattern which extends in the first horizontal direction, and is spaced apart from the second active pattern by a second distance greater than the first distance in the second horizontal direction, a first gate electrode which extends in the second horizontal direction on the first to third active patterns, a second gate electrode which extends in the second horizontal direction on the first and second active patterns, and is spaced apart from the first gate electrode in the first horizontal direction, a first gate contact and a second gate contact which extends in the second horizontal direction on the second gate electrode.

公开(公告)号：US20140138799A1

公开(公告)日：2014-05-22

申请号：US14062201

申请日：2013-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won-keun KIM ,  Sang-Wook PARK

IPC: H01L23/538

CPC classification number: H01L21/561 ,  H01L21/76898 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/81 ,  H01L2224/83

Abstract: Semiconductor packages capable of reducing a total height thereof and methods of manufacturing the semiconductor package are provided. The semiconductor package includes a semiconductor substrate having first and second surfaces opposite to each other, a semiconductor device formed on the first surface of the semiconductor substrate, pads formed on the first surface of the semiconductor substrate and electrically connected to the semiconductor device, and at least one printed circuit layer including a resin layer, via electrodes penetrating through the resin layer, and line layers formed on the first resin layer and connected to the via electrodes and attached onto the first surface of the semiconductor substrate. The via electrodes and the line layers are formed of the same type of material, and the via electrodes are electrically connected to the pads.

Abstract translation: 提供能够降低其总高度的半导体封装以及制造半导体封装的方法。 半导体封装包括具有彼此相对的第一和第二表面的半导体衬底，形成在半导体衬底的第一表面上的半导体器件，形成在半导体衬底的第一表面上并与半导体器件电连接的焊盘 至少一个包括树脂层的印刷电路层，穿过树脂层的电极，以及形成在第一树脂层上并连接到通孔电极并连接到半导体衬底的第一表面上的线层。 通孔电极和线层由相同类型的材料形成，并且通孔电极电连接到焊盘。

公开(公告)号：US20130093669A1

公开(公告)日：2013-04-18

申请号：US13651781

申请日：2012-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Wook PARK ,  SeeUooRee HONG

IPC: G09G5/00

CPC classification number: G09G5/14 ,  G06F3/0487 ,  G06F2203/04803 ,  G09G2340/045 ,  G09G2354/00 ,  G09G2370/16 ,  G09G2380/02

Abstract: An apparatus and method for controlling a screen in a wireless terminal including a bendable display unit for easily controlling the screen, the apparatus including a bendable display unit, a bending detector for detecting bending of the bendable display unit, and a controller for controlling the bendable display unit to up-scale and display data in a non-bent screen region on the bendable display unit when the bendable display unit is bent.

Abstract translation: 一种用于控制无线终端中的屏幕的装置和方法，包括用于容易地控制屏幕的可弯曲显示单元，该装置包括可弯曲显示单元，用于检测可弯曲显示单元的弯曲的弯曲检测器，以及用于控制可弯曲显示单元的控制器 显示单元，以在弯曲显示单元弯曲时在可弯曲显示单元上的非弯曲屏幕区域中显示数据。

公开(公告)号：US20180143806A1

公开(公告)日：2018-05-24

申请号：US15634276

申请日：2017-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Wook PARK ,  Bohdan KARPINSKYY ,  Yong Ki LEE ,  Yunhyeok CHOI ,  Mijung NOH

IPC: G06F7/58

CPC classification number: G06F7/582 ,  G06F7/588

Abstract: A random number generator may include a first meta-stable inverter having an input terminal and an output terminal connected to each other and configured to generate a meta-stable voltage, an amplifier configured to amplify the meta-stable voltage, control circuitry configured to adjust a threshold voltage of the meta-stable voltage, and a sampler configured to generate a random number based on sampling the meta-stable voltage. The random number generator may be configured to be operated according to different modes of operation of a plurality of modes of operation. The amplifier may be a second meta-stable inverter configured to amplify the meta-stable voltage or include an input terminal and an output terminal that are connected to each other based on the random number generator being operated according to a first mode of operation or a second mode of operation, respectively, of the plurality of modes of operation.

公开(公告)号：US20150130083A1

公开(公告)日：2015-05-14

申请号：US14488707

申请日：2014-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sick PARK ,  In-Young LEE ,  Byoung-Soo KWAK ,  Min-Soo KIM ,  Sang-Wook PARK ,  Tae-Je CHO

IPC: H01L25/065 ,  H01L23/34 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00

Abstract: A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip.

Abstract translation: 一种半导体器件及其制造方法包括提供具有第一连接端子的第一半导体芯片，提供第二半导体芯片，该第二半导体芯片包括彼此相对的顶表面和底表面，并且具有第二连接端子和形成的膜型第一底部填充材料 在其底面上，通过使用第一连接端子将第一半导体芯片接合到安装基板，通过使用第一底部填充材料接合第一半导体芯片和第二半导体芯片，以及形成填充第二底部填充材料之间的空间的第二底部填充材料 安装基板和第一半导体芯片，并且覆盖第一半导体芯片的侧表面和第二半导体芯片的至少一部分侧表面。