Method of manufacturing a semiconductor device
    2.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08753945B2

    公开(公告)日:2014-06-17

    申请号:US13687104

    申请日:2012-11-28

    Abstract: In a method of forming MOS transistor, a gate structure is formed on a substrate and a first spacer layer is formed on the substrate conformal to the gate structure. A second spacer layer is formed on the first spacer layer. A second spacer is formed on the first spacer layer corresponding to a sidewall of the gate structure by partially removing the second spacer layer from the first spacer layer. Impurities are implanted in the substrate by an ion implantation process using the gate structure including the first spacer layer and the second spacer as an ion implantation mask to form source/drain extension regions at surface portions of the substrate around the gate structure.

    Abstract translation: 在形成MOS晶体管的方法中,在衬底上形成栅极结构,并且在与栅极结构一致的衬底上形成第一间隔层。 在第一间隔层上形成第二间隔层。 通过从第一间隔层部分去除第二间隔层,在对应于栅极结构的侧壁的第一间隔层上形成第二间隔物。 通过使用包括第一间隔层和第二间隔物的栅极结构作为离子注入掩模的离子注入工艺将杂质注入到衬底中,以在栅极结构周围的衬底的表面部分处形成源极/漏极延伸区域。

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