Abstract:
A transmitter includes output drivers respectively corresponding to data transmission lines, driver control logic configured to control the output drivers in response to data pattern information, and a data pattern detector configured to detect a data pattern in relation to at least two data transmission lines among the data transmission lines over a predetermined period of time, and output the data pattern information corresponding to the data pattern.
Abstract:
A memory system includes a memory controller and M memory chips. The memory controller generates a first data signal having one of 2M voltage levels different from each other, where M is a natural number greater than or equal to two, and outputs the first data signal through a first channel. The first data signal represents first data including M bits. The M memory chips are commonly connected to the memory controller through the first channel. When the M memory chips have an enabled state, the M memory chips simultaneously receives the first data signal transmitted through the first channel from the memory controller, and simultaneously obtains the M bits included in the first data based on the first data signal. Each of the M memory chips obtains a respective one of the M bits, and operates based on the respective one of the M bits.
Abstract:
A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.
Abstract:
Disclosed are a layer structure including a dielectric layer, a method of manufacturing the dielectric layer, an electronic device including the dielectric layer, and an electronic apparatus including the electronic device. The dielectric layer according to at least one embodiment includes a first layer having a dielectric constant greater than that of silicon oxide and is undoped, a second layer configured to enhance a rutile phase of the first layer, and a third layer configured to increase a bandgap of the first layer. The method of manufacturing a dielectric layer according to an embodiment includes forming a first layer having a dielectric constant greater than that of silicon oxide; forming a phase stabilization layer for stabilizing a rutile phase of the first layer and forming a high-bandgap layer for increasing a bandgap of the first layer.
Abstract:
A nonvolatile memory includes a memory cell array including a plurality of memory cells, a pad configured to be connected to a data input/output line, and an input/output circuit configured to receive data to be programmed in the memory cell array and to transmit data read from the memory cell array. The nonvolatile memory further includes a switch configured to couple and decouple the pad and the input/output circuit responsive to a switch control signal and a control circuit configured to generate the switch control signal responsive to a chip enable signal. Data storage devices and methods using such nonvolatile memories are also described.
Abstract:
A nonvolatile memory includes a memory cell array including a plurality of memory cells, a pad configured to be connected to a data input/output line, and an input/output circuit configured to receive data to be programmed in the memory cell array and to transmit data read from the memory cell array. The nonvolatile memory further includes a switch configured to couple and decouple the pad and the input/output circuit responsive to a switch control signal and a control circuit configured to generate the switch control signal responsive to a chip enable signal. Data storage devices and methods using such nonvolatile memories are also described.
Abstract:
Disclosed is an electronic device which includes a plurality of memory devices, a memory controller, a first signal line that makes electrical connection between the memory controller and a first branch point, a second signal line that makes electrical connection between the first branch point and a second branch point, a third signal line that makes electrical connection between the first branch point and a third branch point, a fourth signal line that electrically connects the second branch point and the first memory device, a fifth signal line that electrically connects the second branch point and the second memory device, a sixth signal line that electrically connects the third branch point and the third memory device, and a stub that includes a first end electrically connected with at least one of the plurality of signal lines, and a second end being left open-circuit.
Abstract:
A storage device is provided. The storage device includes nonvolatile memory devices provided on a printed circuit board (PCB), a connector, a storage controller and at least one first passive filter. The connector is provided in the PCB and includes connection terminals. The storage controller is provided on the PCB, communicates with an external host through the connection terminals and controls the nonvolatile memory devices. The at least one first passive filter is provided in the PCB, is connected between the connector and the storage controller, and performs an equalization on either a signal provided to the storage controller or a signal provided from the storage controller.
Abstract:
A storage device includes a semiconductor memory device and a storage controller. The semiconductor memory device receives write data based on a data strobe signal and data signals, and outputs read data based on the data strobe signal and the data signals. The storage controller transmits the data strobe signal and the data signals in parallel to the semiconductor memory device through signal lines. The storage controller includes a first delay circuit that delays the data signals such that some edges of windows of the data signals on the signal lines are desynchronized by first skew offsets which are different from one another.
Abstract:
A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.