公开(公告)号：US20150102507A1

公开(公告)日：2015-04-16

申请号：US14511158

申请日：2014-10-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol-woo LEE ,  Ji-han KO

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/06135 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29082 ,  H01L2224/29084 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32053 ,  H01L2224/32056 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/48881 ,  H01L2224/48884 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83856 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92147 ,  H01L2224/92165 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/06 ,  H01L2924/10161 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/35 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/05442 ,  H01L2224/83

Abstract: Provided is a semiconductor package that may prevent deformation of stacked semiconductor chips and minimize a semiconductor package size. The semiconductor package includes a package base substrate, a lower chip stacked on the package base substrate, an upper chip stacked on the lower chip, and a first die attach film (DAF) attached to a bottom surface of the upper chip to cover at least a portion of the lower chip. The first DAF may be a multi-layer film including a first attaching layer contacting the bottom surface of the upper chip and a second attaching layer attached to a bottom of the first attaching layer to cover at least a portion of a side surface of the lower chip.

Abstract translation: 提供了可以防止堆叠的半导体芯片的变形并使半导体封装尺寸最小化的半导体封装。 半导体封装包括封装基底基板，堆叠在封装基底基板上的下部芯片，堆叠在下部芯片上的上部芯片，以及附接到上部芯片的底表面上的至少覆盖的第一芯片附着膜（DAF） 下部芯片的一部分。 第一DAF可以是多层膜，其包括接触上芯片的底表面的第一附着层和附接到第一附着层的底部的第二附着层，以覆盖下层的侧表面的至少一部分 芯片。