公开(公告)号：US20200372232A1

公开(公告)日：2020-11-26

申请号：US16989974

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： WOONBAE KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US20190213373A1

公开(公告)日：2019-07-11

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US20240274556A1

公开(公告)日：2024-08-15

申请号：US18481385

申请日：2023-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won CHOI ,  Ji-Yong PARK ,  Bok Sik MYUNG

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/08 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/24 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/08188 ,  H01L2224/13024 ,  H01L2224/24227 ,  H01L2924/381

Abstract: A semiconductor device may include a substrate, a pad on the substrate and connected to an interconnection pattern in the substrate, and a solder resist layer on the substrate, the solder resist layer having an opening exposing the pad. A top surface of the pad having a center region, and a peripheral region surrounding the center region. The center region of the top surface of the pad may be located at a level different from the peripheral region of the top surface of the pad, and a first width of the pad may be constant regardless of a distance from the substrate.

公开(公告)号：US20230260887A1

公开(公告)日：2023-08-17

申请号：US17903209

申请日：2022-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se-Ho YOU ,  Ji-Yong PARK

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49833 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16137 ,  H01L2224/16227 ,  H01L2224/32137 ,  H01L2224/73203 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1511 ,  H01L2924/15151

Abstract: A semiconductor package includes a first substrate including a first wiring layer inside the first substrate, a second substrate including a second wiring layer inside the second substrate, and a mold layer between the first substrate and the second substrate. An upper surface of the mold layer is on a same plane as upper surfaces of the first substrate and the second substrate. The package includes a first connecting film on each of the upper surface of the first substrate and the upper surface of the second substrate, the first connecting film connecting the first substrate and the second substrate, and a first semiconductor chip on the upper surface of the first substrate. The first semiconductor chip is spaced apart from the first connecting film, and an upper surface of the first connecting film is lower than an upper surface of the first semiconductor chip.

公开(公告)号：US20240030176A1

公开(公告)日：2024-01-25

申请号：US18112323

申请日：2023-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Yong PARK ,  Jeong Hyun Lee ,  Choon Bin Yim

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L24/32 ,  H01L24/96 ,  H01L24/97 ,  H01L24/16 ,  H01L24/29 ,  H01L24/73 ,  H01L21/565 ,  H01L21/561 ,  H01L21/4853 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/13 ,  H01L24/83 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/3201 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1011 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/29005 ,  H01L2224/83091 ,  H01L2224/83201

Abstract: A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.

公开(公告)号：US20170235997A1

公开(公告)日：2017-08-17

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho CHOI ,  Youngdoo JUNG ,  Woonbae KIM ,  Jungwoo KIM ,  Ji-Yong PARK ,  Kyoungsuk YANG ,  Jeong-Kyu HA

IPC: G06K9/00

CPC classification number: G06K9/00087 ,  G06K9/00013

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US20170338846A1

公开(公告)日：2017-11-23

申请号：US15675225

申请日：2017-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Hwan LEE ,  Ji-Yong PARK

IPC: H04B1/3888 ,  G06F3/048 ,  H04M1/02 ,  A45C11/00 ,  H04M1/725 ,  G06F3/14 ,  H04M1/04

CPC classification number: H04B1/3888 ,  A45C11/00 ,  A45C2011/002 ,  G06F3/048 ,  G06F3/14 ,  G06F2200/1634 ,  H04M1/0202 ,  H04M1/0214 ,  H04M1/04 ,  H04M1/72527

Abstract: An accessory device of a portable electronic device is provided. The accessory device includes a first cover that is detachably attached to at least a portion of the electronic device, a second cover that is connected to the first cover, at least a portion of the second cover covering at least a portion of a display of the electronic device, and an electronic circuit that is arranged inside the first cover or the second cover. The electronic circuit may include a memory that stores at least some of codes or data that indicate one or more of identification information, a characteristic, a configuration, a structure, and a function that are associated with a protection cover. Various pieces of corresponding information may be output according to the kinds of applied accessories. Therefore, the consumers' product preference can be improved and the reliability of the electronic device can be secured.

公开(公告)号：US20160197637A1

公开(公告)日：2016-07-07

申请号：US14912778

申请日：2014-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Hwan LEE ,  Ji-Yong PARK

IPC: H04B1/3888 ,  H04M1/02 ,  G06F3/14

CPC classification number: H04B1/3888 ,  A45C11/00 ,  A45C2011/002 ,  G06F3/048 ,  G06F3/14 ,  G06F2200/1634 ,  H04M1/0202 ,  H04M1/0214 ,  H04M1/04 ,  H04M1/72527

Abstract: Various embodiments of the present disclosure provide an accessory device of a portable electronic device. The accessory device includes a first cover that is detachably attached to at least a portion of the electronic device, a second cover that is connected to the first cover, at least a portion of the second cover covering at least a portion of a display of the electronic device, and an electronic circuit that is arranged inside the first cover or the second cover. The electronic circuit may include a memory that stores at least some of codes or data that indicate one or more of identification information, a characteristic, a configuration, a structure, and a function that are associated with a protection cover. Various pieces of corresponding information may be output according to the kinds of applied accessories. Therefore, the consumers' product preference can be improved and the reliability of the electronic device can be secured.

Abstract translation: 本公开的各种实施例提供便携式电子设备的附件装置。 附件装置包括可拆卸地附接到电子装置的至少一部分的第一盖，连接到第一盖的第二盖，第二盖的至少一部分覆盖至少一部分显示器 电子设备和布置在第一盖或第二盖内的电子电路。 电子电路可以包括存储器，其存储指示与保护盖相关联的识别信息，特性，配置，结构和功能中的一个或多个的代码或数据的至少一些。 可以根据应用的配件的种类输出各种相应的信息。 因此，可以提高消费者的产品偏好，并且可以确保电子设备的可靠性。