公开(公告)号：US20240136273A1

公开(公告)日：2024-04-25

申请号：US18368760

申请日：2023-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geunwoo KIM ,  Sungeun JO

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/433 ,  H01L25/00 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L23/49838 ,  H01L23/4334 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H10B80/00 ,  H01L23/3128 ,  H01L2224/16227 ,  H01L2224/32221 ,  H01L2224/73253 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443

Abstract: A semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.

公开(公告)号：US20230178450A1

公开(公告)日：2023-06-08

申请号：US17892252

申请日：2022-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun JO ,  Jaemin JUNG ,  Jaechoon KIM ,  Seunggeol RYU ,  Kyungsuk OH

IPC: H01L23/367 ,  H01L23/528

CPC classification number: H01L23/367 ,  H01L23/5283

Abstract: A film package, includes: a film substrate having first and second surfaces opposing each other; a plurality of wiring patterns respectively including an input pattern, an output pattern, and an interconnection pattern; a first semiconductor chip electrically connected to the input pattern and the interconnection pattern; a second semiconductor chip electrically connected to the interconnection pattern and the output pattern; a protective layer on the first surface to cover at least a portion of the plurality of wiring patterns; a first conductive film on the protective layer and extending in a second direction; and a second conductive film on the second surface to overlap the first conductive film in a third direction.

公开(公告)号：US20200373341A1

公开(公告)日：2020-11-26

申请号：US16667041

申请日：2019-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungeun JO ,  Youngshin KWON

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor package including an image sensor chip including an active pixel sensor region and a non-sensing region, a plurality of chip pads being in the non-sensing region; a printed circuit board on one side of the image sensor chip, the printed circuit board including a plurality of bonding pads; conductive wires respectively connecting the plurality of chip pads to the plurality of bonding pads; a bonding dam at a periphery of the active pixel sensor region; a cover glass on the bonding dam and facing another side of the image sensor chip; and an encapsulation layer covering a side surface of the bonding dam, a side surface of the cover glass, an edge of a lower surface of the cover glass, the non-sensing region, and an edge of an upper surface of the printed circuit board, wherein the bonding dam is spaced apart from an end of a side surface of the image sensor chip by a distance of 80 μm to 150 μm has a height of 50 μm to 150 μm from the image sensor chip, and has a width of 160 μm to 240 μm.

公开(公告)号：US20200372232A1

公开(公告)日：2020-11-26

申请号：US16989974

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： WOONBAE KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US20240268068A1

公开(公告)日：2024-08-08

申请号：US18357493

申请日：2023-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungeun JO ,  Byungwoo BANG ,  Junyeon LEE ,  Wooseok CHANG ,  Hun Seong CHOI

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  H05K7/20236 ,  H05K7/20272

Abstract: An immersion cooling system including an electronic device including a plurality of boards, the electronic device being configured in the immersive cooling system to be immersed in refrigerant that a reservoir is configured to accommodate, a pump array including a plurality of pumps disposed inside the reservoir, each pump of the plurality of pumps configured to individually generate a flow of the refrigerant by performing a discharging of the refrigerant, and a controller, the controller being configured to individually control an operation of each pump of the plurality of pumps, determine a board of the plurality of boards that requires cooling, identify a pump corresponding to the determined board among the plurality of pumps, and increase a flow quantity of the refrigerant discharged from the identified pump.

公开(公告)号：US20240234287A9

公开(公告)日：2024-07-11

申请号：US18368760

申请日：2023-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geunwoo KIM ,  Sungeun JO

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/433 ,  H01L25/00 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L23/49838 ,  H01L23/4334 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H10B80/00 ,  H01L23/3128 ,  H01L2224/16227 ,  H01L2224/32221 ,  H01L2224/73253 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443

Abstract: A semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.

公开(公告)号：US20190186960A1

公开(公告)日：2019-06-20

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun JO ,  YOUNGSHIN KWON ,  Minjin KIM ,  WOONBAE KIM ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  INHO CHOI

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US20250053208A1

公开(公告)日：2025-02-13

申请号：US18767342

申请日：2024-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun JO ,  Byungwoo BANG

IPC: G06F1/20 ,  H05K7/20

Abstract: A system includes a main board and sub-board units connected thereto. Each sub-board unit includes: a first sub-board connected to the main board and first chips arranged on a side of the first sub-board; a second sub-board connected to the main board and second chips arranged on a side of the second sub-board; and a cooling structure between the first sub-board and the second sub-board. The first sub-board and the second sub-board are arranged such that the side of the first sub-board and side of the second sub-board both face the cooling structure. A first region of the first sub-board defined by an outline of a first chip is directly opposite an identical second region of the second sub-board, and at least a portion of a second chip that corresponds to the first chip is outside the second region.

公开(公告)号：US20190213373A1

公开(公告)日：2019-07-11

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US20190212312A1

公开(公告)日：2019-07-11

申请号：US16124385

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjin KIM ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  Sungeun JO ,  INHO CHOI

IPC: G01N33/00 ,  G01N27/12 ,  G01N27/407 ,  G01N27/04 ,  H01L23/498 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00

CPC classification number: G01N33/0027 ,  G01D11/245 ,  G01N27/048 ,  G01N27/123 ,  G01N27/128 ,  G01N27/407 ,  H01L23/02 ,  H01L23/3107 ,  H01L23/49805 ,  H01L24/48 ,  H01L27/0248 ,  H01L2224/48227 ,  H05K1/0306 ,  H05K2201/10151

Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.