公开(公告)号：US11211273B2

公开(公告)日：2021-12-28

申请号：US16424834

申请日：2019-05-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Han Ko ,  Wonkeun Kim

IPC: H01L21/673 ,  H01L21/50 ,  C03C27/06 ,  B32B17/06 ,  H01L23/00

Abstract: A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.

公开(公告)号：US20130270717A1

公开(公告)日：2013-10-17

申请号：US13672310

申请日：2012-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Han Ko ,  Woo-Dong Lee ,  Tae-Sung Park

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/065 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam.

Abstract translation: 半导体封装包括电路板，其包括与第一表面相对的第一表面和第二表面。 第一半导体芯片堆叠在第一表面上，第二半导体芯片堆叠在第一半导体芯片上。 第二芯片的区域突出超过第一半导体芯片的一侧。 支撑件支撑第二芯片的突出区域。 支撑体可以是例如干膜阻焊堤。

公开(公告)号：US20190122995A1

公开(公告)日：2019-04-25

申请号：US16052117

申请日：2018-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Han Ko ,  Bo Ram Kang ,  Dong Kwan Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.

公开(公告)号：US09177886B2

公开(公告)日：2015-11-03

申请号：US13672310

申请日：2012-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Han Ko ,  Woo-Dong Lee ,  Tae-Sung Park

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/065 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam.

Abstract translation: 半导体封装包括电路板，其包括与第一表面相对的第一表面和第二表面。 第一半导体芯片堆叠在第一表面上，第二半导体芯片堆叠在第一半导体芯片上。 第二芯片的区域突出超过第一半导体芯片的一侧。 支撑件支撑第二芯片的突出区域。 支撑体可以是例如干膜阻焊堤。