公开(公告)号：US10896879B2

公开(公告)日：2021-01-19

申请号：US16201708

申请日：2018-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kun Sil Lee ,  Dong Kwan Kim ,  Bo Ram Kang ,  Ho Geon Song ,  Won Keun Kim

IPC: H01L23/552 ,  G01N23/18

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

公开(公告)号：US20190122995A1

公开(公告)日：2019-04-25

申请号：US16052117

申请日：2018-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Han Ko ,  Bo Ram Kang ,  Dong Kwan Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.