公开(公告)号：US20160240509A1

公开(公告)日：2016-08-18

申请号：US15135364

申请日：2016-04-21

申请人： Samsung Electronics Co., Ltd.

发明人： Heungkyu KWON ,  Kang Joon LEE ,  JaeWook YOO ,  Su-Chang LEE

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49811 ,  H01L23/13 ,  H01L23/16 ,  H01L23/18 ,  H01L23/3157 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13561 ,  H01L2224/13583 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13649 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/1367 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/13679 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/1401 ,  H01L2224/1403 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14181 ,  H01L2224/14505 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/1712 ,  H01L2224/17181 ,  H01L2224/175 ,  H01L2224/1751 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/206 ,  H01L2924/014 ,  H01L2224/05552

摘要： Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.

摘要翻译： 半导体封装包括包括中心部分和周边部分的第一基板，附接到第一基板的中心部分的至少一个第一中心连接部件和附接到第一基板的周边部分的至少一个第一周边连接部件。 第一中心连接构件包括第一支撑件和围绕第一支撑件的第一融合导电层。

公开(公告)号：US20190172792A1

公开(公告)日：2019-06-06

申请号：US16270184

申请日：2019-02-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： JaeWook YOO

IPC分类号： H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L21/02

摘要： A semiconductor package and a method of fabricating the same, the method including mounting semiconductor chips on a substrate; forming a mold layer that covers the semiconductor chips on the substrate; forming external terminals on a bottom surface of the substrate; forming a separation layer on the external terminals and the bottom surface of the substrate; cutting the substrate and the mold layer to separate the semiconductor chips from each other; and forming a shield surrounding the mold layer and a side surface of the substrate.

公开(公告)号：US20180068956A1

公开(公告)日：2018-03-08

申请号：US15499353

申请日：2017-04-27

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： JaeWook YOO

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L21/02 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L21/02068 ,  H01L21/4817 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/09 ,  H01L24/11 ,  H01L24/14 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor package and a method of fabricating the same, the method including mounting semiconductor chips on a substrate; forming a mold layer that covers the semiconductor chips on the substrate; forming external terminals on a bottom surface of the substrate; forming a separation layer on the external terminals and the bottom surface of the substrate; cutting the substrate and the mold layer to separate the semiconductor chips from each other; and forming a shield surrounding the mold layer and a side surface of the substrate.