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    PACKAGE-ON-PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
    3.
    发明申请
    PACKAGE-ON-PACKAGE AND PACKAGE MODULE INCLUDING THE SAME 有权

    公开(公告)号：US20230050969A1

    公开(公告)日：2023-02-16

    申请号：US17884143

    申请日：2022-08-09

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Heungkyu KWON ,  Heejung CHOI ,  Kyojin HWANG

    IPC分类号： H01L25/18 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00

    摘要： Provided is a package-on-package (PoP). The PoP includes a lower package, an upper package on the lower package, an interposer substrate disposed between the lower package and the upper package, and a plurality of balls connecting the interposer substrate to the upper package, in which the lower package includes a first substrate, and a first die and a second die disposed side by side in a horizontal direction, on the first substrate, in which the upper package includes a second substrate, a third die on the second substrate, and a plurality of ball pads disposed on a surface of the second substrate, the interposer substrate comprises on a surface thereof a plurality of ball lands to which a plurality of balls are attached, and at least some of the plurality of ball lands overlap the first die and the second die in a vertical direction that intersects the horizontal direction.

    SEMICONDUCTOR MODULE
    4.
    发明申请
    SEMICONDUCTOR MODULE 审中-公开

    公开(公告)号：US20200235083A1

    公开(公告)日：2020-07-23

    申请号：US16744437

    申请日：2020-01-16

    申请人： Samsung Electronics Co., Ltd.

    发明人： Heungkyu KWON

    IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L23/367 ,  H01L23/498

    摘要： A semiconductor module may include a system board including a top surface and a bottom surface, a module substrate provided on the top surface of the system board, a system semiconductor package mounted on the module substrate, and first and second power management semiconductor packages mounted on the module substrate. The first and second power management semiconductor packages may be spaced apart from each other in a first direction, which is parallel to a top surface of the module substrate, with the system semiconductor package interposed therebetween.

    SEMICONDUCTOR PACKAGE SYSTEM
    6.
    发明申请
    SEMICONDUCTOR PACKAGE SYSTEM 有权

    公开(公告)号：US20210358831A1

    公开(公告)日：2021-11-18

    申请号：US17384863

    申请日：2021-07-26

    申请人： Samsung Electronics Co., Ltd.

    发明人： Heungkyu KWON

    IPC分类号： H01L23/373 ,  H01L23/31 ,  H01L23/367 ,  H01L23/00

    摘要： Provided is a semiconductor package system. The system includes a substrate, a first semiconductor package on the substrate, a second semiconductor package on the substrate, a first passive element on the substrate, a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element, and a first heat conduction layer between the first semiconductor package and the heat dissipation structure. A sum of a height of the first semiconductor package and a thickness of the first heat conduction layer may be greater than a height of the first passive element. The height of the first semiconductor package may be greater than a height of the second semiconductor package.

    SEMICONDUCTOR PACKAGE SYSTEM
    7.
    发明申请
    SEMICONDUCTOR PACKAGE SYSTEM 有权

    公开(公告)号：US20210233827A1

    公开(公告)日：2021-07-29

    申请号：US17232495

    申请日：2021-04-16

    申请人： Samsung Electronics Co., Ltd.

    发明人： Heungkyu KWON

    IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L25/16

    摘要： A semiconductor package system includes a substrate, a first and a second semiconductor package, a first thermal conductive layer, a first passive device, and a heat radiation structure. The first and second semiconductor package and first passive device may be mounted on a top surface of the substrate. The first semiconductor package may include a first semiconductor chip that includes a plurality of logic circuits. The first thermal conductive layer may be on the first semiconductor package. The heat radiation structure may be on the first thermal conductive layer, the second semiconductor package, and the first passive device. The heat radiation structure may include a first bottom surface physically contacting the first thermal conductive layer, and a second bottom surface at a higher level than that of the first bottom surface. The second bottom surface may be on the second semiconductor package and/or the first passive device.

    SEMICONDUCTOR PACKAGE SYSTEM
    8.
    发明申请
    SEMICONDUCTOR PACKAGE SYSTEM 审中-公开

    公开(公告)号：US20200091030A1

    公开(公告)日：2020-03-19

    申请号：US16573107

    申请日：2019-09-17

    申请人： Samsung Electronics Co., Ltd.

    发明人： Heungkyu KWON

    IPC分类号： H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48

    摘要： Disclosed is a semiconductor package system comprising a substrate, a first semiconductor package on the substrate, and a heat radiation structure on the first semiconductor package. The heat radiation structure includes a first part on a top surface of the first semiconductor package and a second part connected to the first part. The second part has a bottom surface at a level lower than a level of the top surface of the first semiconductor package. A vent hole is provided between an edge region of the substrate and the first part of the heat radiation structure.