公开(公告)号：US20240152206A1

公开(公告)日：2024-05-09

申请号：US18414824

申请日：2024-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon KIM ,  Hyungsuk KIM ,  Heekuk LEE ,  Inho CHOI

IPC: G06F3/01 ,  G06Q30/0241 ,  G06T7/12 ,  G06T7/246 ,  G06T7/73 ,  G06V20/50 ,  G06V40/10

CPC classification number: G06F3/013 ,  G06T7/12 ,  G06T7/246 ,  G06T7/73 ,  G06V20/50 ,  G06V40/10 ,  G06Q30/0277 ,  G06T2207/10024 ,  G06T2207/10028 ,  G06T2207/30196

Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a housing, a display, a camera sensor, a wireless communication circuit, and at least one processor, comprising processing circuitry, electrically connected to the display, the camera sensor, and the wireless communication circuit, wherein at least one processor, individually and/or collectively, is configured to control the electronic device to: recognize a first object and a second object through at least one of the camera sensor and the wireless communication circuit; determine a first coordinate value on the display, corresponding to the first object, and a second coordinate value on the display, corresponding to the second object; determine a first region of the display based on the first coordinate value; determine a second region of the display based on the second coordinate value; output a first content corresponding to the first object on the first region; output a second content corresponding to the second object on the second region; and based on the distance between the first coordinate value and the second coordinate value being within a specified range, arrange the first content and the second content in the vertical direction of the display.

公开(公告)号：US20230338852A1

公开(公告)日：2023-10-26

申请号：US18215531

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sujung BAE ,  Kyuwon KIM ,  Jongkyu KIM ,  Tushar Balasaheb SANDHAN ,  Myoungho LEE ,  Heekuk LEE ,  Inho CHOI

IPC: A63F13/56 ,  A63F13/52 ,  G06T7/20 ,  G06F3/14

CPC classification number: A63F13/56 ,  A63F13/52 ,  G06F3/14 ,  G06T7/20

Abstract: An electronic device includes an input device, a display, a communication circuit, and a processor operatively connected to the input device, the display, and the communication circuit. The processor is configured to receive a first image frame from an external electronic device through the communication circuit; display the received first image frame, receive a first user input through the input device in a state in which the first image frame is displayed, predict a second user input on the basis of the first image frame and the first user input, generate a prediction input event corresponding to the predicted second user input, transmit information on the prediction input event to the external electronic device through the communication circuit, receive a second image frame according to the prediction input event from the external electronic device through the communication circuit and display the received second image frame.

公开(公告)号：US20230144163A1

公开(公告)日：2023-05-11

申请号：US17939293

申请日：2022-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongbin PARK ,  Minseok CHOI ,  Inho CHOI ,  Jeonggil KIM

IPC: G03F7/20

CPC classification number: G03F7/70925 ,  G03F7/7085

Abstract: An apparatus for removing a residue of an EUV light source vessel including an internal side surface having a curved surface is provided. The apparatus includes a frame portion configured to be disposed on a bottom surface of an EUV light source vessel and a head portion above the frame portion. The head portion is configured to be rotatably moved on a circular trajectory while maintaining a desired (and/or alternatively predetermined) distance from the curved surface of the EUV light source vessel. The head portion may have a heating member configured to emit heat toward the curved surface of the EUV light source vessel. The heating member may have a shape curved in an arc corresponding to a portion of the circular trajectory.

公开(公告)号：US20250131230A1

公开(公告)日：2025-04-24

申请号：US18672381

申请日：2024-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Youngjun YOON ,  Soyoung LIM ,  Jaehyun LIM ,  Inho CHOI

IPC: G06K19/07 ,  G06K19/077 ,  G06V40/13

Abstract: A fingerprint sensor package carrier includes: a film member including through-holes formed in sides of the film member; and a plurality of fingerprint sensor packages arranged on the film member, wherein each of the plurality of fingerprint sensor packages includes a substrate and a controller chip disposed on the substrate, wherein the substrate of each of the plurality of fingerprint sensor packages includes a plurality of first sensing patterns and a plurality of second sensing patterns, wherein the plurality of first sensing patterns are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, and the plurality of second sensing patterns are spaced apart from each other in the second direction and extend in the first direction, and wherein the film member has adhesiveness, such that the plurality of fingerprint sensor packages are configured to be detached from the film member.

公开(公告)号：US20250096085A1

公开(公告)日：2025-03-20

申请号：US18767435

申请日：2024-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung LIM ,  Inho CHOI

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

Abstract: A chip on film (COF) package may include a base film including a first side extending in a first horizontal direction, a plurality of conductive lines on an upper surface of the base film and extending in a second horizontal direction perpendicular to the first horizontal direction, a plurality of bridge patterns respectively connected with the plurality of conductive lines and arranged along the first side of the base film, an interlayer insulation layer on the base film and covering a plurality of bridge patterns, and a plurality of input pads on the interlayer insulation layer and respectively connected with the plurality of bridge patterns.

公开(公告)号：US20240046692A1

公开(公告)日：2024-02-08

申请号：US18131133

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin LEE ,  Jaehyun LIM ,  Heeyoub KANG ,  Hyunjong MOON ,  Yun Seok CHOI ,  Inho CHOI

IPC: G06V40/13 ,  G06K19/073

CPC classification number: G06V40/1306 ,  G06K19/07354

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

公开(公告)号：US20170235997A1

公开(公告)日：2017-08-17

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho CHOI ,  Youngdoo JUNG ,  Woonbae KIM ,  Jungwoo KIM ,  Ji-Yong PARK ,  Kyoungsuk YANG ,  Jeong-Kyu HA

IPC: G06K9/00

CPC classification number: G06K9/00087 ,  G06K9/00013

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US20160225669A1

公开(公告)日：2016-08-04

申请号：US14993054

申请日：2016-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho CHOI ,  Donghan KIM ,  Jae Choon KIM ,  Jikho SONG ,  Mitsuo UMEMOTO

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.

Abstract translation: 公开了制造半导体封装的方法。 该方法包括将半导体芯片布置在支撑基板上，形成覆盖半导体芯片顶表面的保护层，形成覆盖支撑基板和保护层的模制层，以及蚀刻模塑层以露出保护层。

公开(公告)号：US20230262323A1

公开(公告)日：2023-08-17

申请号：US18102956

申请日：2023-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungkyu CHOI ,  Sujung BAE ,  Kwangmin BYEON ,  Inho CHOI

IPC: H04N23/60 ,  G06V10/26 ,  G06V10/56 ,  G06V40/20 ,  H04N23/611 ,  G06T7/246

CPC classification number: H04N23/64 ,  G06V10/26 ,  G06V10/56 ,  G06V40/20 ,  H04N23/611 ,  G06T7/248 ,  G06T2207/30244 ,  G06T2207/30196 ,  G06V10/764

Abstract: An example electronic device is configured to divide an image into a plurality of areas, calculate a number of feature points included in each of the plurality of divided areas by detecting the feature points from the image, select at least one candidate area among the plurality of divided areas based on a result of the calculating, and generate an image of the target object based on a partial image captured from the capture area determined in at least one selected candidate area.

公开(公告)号：US20220130019A1

公开(公告)日：2022-04-28

申请号：US17571664

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moonhwan JEONG ,  Yoonsang KIM ,  Sujung BAE ,  Inho CHOI ,  Seon HEO

IPC: G06T5/00 ,  G06N20/00 ,  G06T5/50 ,  G06N3/04 ,  G06V10/25 ,  G06V40/16

Abstract: An electronic device according to an embodiment disclosed herein may include a communication circuit, a processor; and a memory configured to be operatively connected to the processor. The memory according to an embodiment may store instructions that, when executed, cause the processor to: recognize an area comprising at least part of a face in an image to be transmitted to an external device; generate perturbation data about the recognized area based on a machine learning model stored in the memory; apply the perturbation data to the recognized area; and transmit the image to which the perturbation data has been applied to the external device. Various other embodiments are possible.