公开(公告)号：US20140196280A1

公开(公告)日：2014-07-17

申请号：US14217744

申请日：2014-03-18

Applicant: Samsung Electronics Co., Ltd

Inventor： Chang-Seong JEON ,  Ho-Geon SONG ,  Mitsuo UMEMOTO ,  Sang-Sick PARK

IPC: H01L23/00 ,  H01L21/67

CPC classification number: H01L24/74 ,  H01L21/67 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32151 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7525 ,  H01L2224/75252 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/7901 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.

Abstract translation: 制造倒装芯片封装的方法和装置包括将焊剂点到封装衬底的第一预备凸块上，通过焊剂将第一半导体芯片的初步凸点附着到封装衬底的第一初步凸块上，点焊焊剂 封装衬底的第二初步凸块，以及通过焊剂将第二半导体芯片的预备凸块附接到封装衬底的第二初级凸块。 因此，可以抑制在封装衬底的初步凸块上的焊剂的蒸发。

公开(公告)号：US20160225669A1

公开(公告)日：2016-08-04

申请号：US14993054

申请日：2016-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho CHOI ,  Donghan KIM ,  Jae Choon KIM ,  Jikho SONG ,  Mitsuo UMEMOTO

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.

Abstract translation: 公开了制造半导体封装的方法。 该方法包括将半导体芯片布置在支撑基板上，形成覆盖半导体芯片顶表面的保护层，形成覆盖支撑基板和保护层的模制层，以及蚀刻模塑层以露出保护层。

公开(公告)号：US20160051197A1

公开(公告)日：2016-02-25

申请号：US14703833

申请日：2015-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mitsuo UMEMOTO ,  Yung-Cheol KONG ,  Woon-Bae KIM ,  Pyoung-Wan KIM ,  Kyong-Soon CHO

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/0215

CPC classification number: A61B5/6861 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/14503 ,  A61B5/14532 ,  A61B2562/162 ,  A61B2562/166

Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Abstract translation: 提供了一种用于处理用于到外部设备的无线通信的生物许可数据的体内植入式包装。 该封装包括一个由盖子封闭的管，其中具有固定到其上的应变层的芯片形成柔性层流电路。 在层压芯片和应变层插入其中之后，将盖安装在管的开口端上。 芯片由一个或多个匝构成并卷成大致圆柱形。 应变层自动固定在芯片的表面上，使得柔性层流电路卷曲成大致圆柱形，以装配在管内。