公开(公告)号：US20220027700A1

公开(公告)日：2022-01-27

申请号：US17212549

申请日：2021-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin LEE

IPC: G06K19/07 ,  G06K9/00

Abstract: A smart card including a fingerprint sensor package is provided. The fingerprint sensor package includes first sensing patterns, second sensing patterns, ground patterns, and a controller integrated circuit (IC). The first sensing patterns extend in a first direction. The second sensing patterns are disposed on the first sensing patterns and extend in a second direction crossing the first direction. The ground patterns are between the first sensing patterns and the controller IC.

公开(公告)号：US20240046692A1

公开(公告)日：2024-02-08

申请号：US18131133

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin LEE ,  Jaehyun LIM ,  Heeyoub KANG ,  Hyunjong MOON ,  Yun Seok CHOI ,  Inho CHOI

IPC: G06V40/13 ,  G06K19/073

CPC classification number: G06V40/1306 ,  G06K19/07354

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

公开(公告)号：US20230177300A1

公开(公告)日：2023-06-08

申请号：US17863688

申请日：2022-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwangjin LEE ,  Jaehyun LIM ,  Hyunjong MOON

IPC: G06K19/07 ,  G06V40/13

CPC classification number: G06K19/0718 ,  G06V40/13

Abstract: Provided is a fingerprint sensor package including a first substrate including first bonding pads and an external connection pad, a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, second bonding pads, and test pads, conductive wires electrically connecting the first bonding pads and the second bonding pads, a controller chip connected to the second substrate, and a molding layer covering the controller chip and the second substrate and in contact with the first bonding pads, the second bonding pads, the test pads, and the conductive wires.