SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20250048699A1

    公开(公告)日:2025-02-06

    申请号:US18607960

    申请日:2024-03-18

    Abstract: A semiconductor device includes a substrate including an active pattern, a channel pattern and a source/drain pattern on the active pattern wherein the channel pattern includes semiconductor patterns vertically stacked and spaced apart from each other, the plurality of semiconductor patterns including a first semiconductor pattern and a neighboring second semiconductor pattern, and a gate electrode on the semiconductor patterns. The gate electrode includes an inner electrode between the first and second semiconductor patterns. The source/drain pattern includes a buffer layer and a main layer on the buffer layer. An indent region is defined in a vertical cross section of the device by the main layer, the first and second semiconductor patterns, and the inner electrode. The buffer layer is in the indent region. The buffer layer does not extend onto sidewalls of the first and second semiconductor patterns.

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20250133793A1

    公开(公告)日:2025-04-24

    申请号:US18663416

    申请日:2024-05-14

    Abstract: A semiconductor device includes a substrate; an active pattern extending on the substrate in a first direction; a plurality of channel layers on the active pattern and spaced apart from each other in a vertical direction; a gate structure crossing the active pattern, the gate structure surrounding the plurality of channel layers and extending in a second direction orthogonal to the first direction; and source/drain patterns on a region of the active pattern on both sides of the gate structure, and having a semiconductor liner layer connected to each of side surfaces of the plurality of channel layers, and a semiconductor filling layer on the semiconductor liner layer. The semiconductor liner layer includes silicon-germanium (SiGe) doped with a first conductivity-type impurity. The semiconductor filling layer includes an epitaxial layer having a germanium (Ge) concentration higher than that of the semiconductor liner layer, and the epitaxial layer is doped with Ga.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20230100189A1

    公开(公告)日:2023-03-30

    申请号:US17730928

    申请日:2022-04-27

    Abstract: A semiconductor device includes a fin-type active region that protrudes from a substrate and extends in a first direction, a plurality of channel layers on the fin-type active region that are spaced apart from each other in a second direction that is perpendicular to an upper surface of the substrate, a gate structure that intersects the fin-type active region, extends in the second direction, and surrounds each of the plurality of channel layers in a third direction, fence spacers on side surfaces of the fin-type active region in the second direction on sides of the gate structure and extending in the second direction, and a source/drain region between the fence spacers on the fin-type active region at sides of the gate structure, connected to each of the plurality of channel layers, and having voids in side surfaces adjacent the fence spacers.

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