公开(公告)号：US20210160357A1

公开(公告)日：2021-05-27

申请号：US15734612

申请日：2019-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon KIM ,  Chulwoo PARK

IPC: H04M1/02 ,  H01M50/519 ,  H01M50/538

Abstract: According to various embodiments of the present invention, an electronic device may comprise: a housing, which comprises a first plate, a second plate facing the opposite direction to the first plate, and a side surface member surrounding a space between the first plate and the second plate; a display viewed through at least a part of the first plate; a battery, which is disposed in the housing and comprises a battery cell comprising multiple cell parts, at least some of which are arranged to overlap each other when viewed from above one surface of the battery, and multiple conductive members arranged so as to overlap each other at the edges of the multiple cell parts when viewed from above the one surface; a battery protection circuit joined to the multiple conductive members; and a processor operationally connected to the display and the battery. Various other embodiments may also be possible.

公开(公告)号：US20150159085A1

公开(公告)日：2015-06-11

申请号：US14566614

申请日：2014-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takamasa IZAWA ,  Dohoon KIM ,  Masahiko YOSHINO ,  Takatoshi SETO

IPC: C09K11/77 ,  H01L33/56 ,  F21K99/00 ,  H01L33/50

CPC classification number: C09K11/7792 ,  C09K11/0883 ,  F21K9/23 ,  F21S41/125 ,  F21S41/14 ,  F21S41/147 ,  F21S41/16 ,  F21Y2115/10 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A yellow phosphor is provided. The yellow phosphor includes a crystal formed of a compound that is represented by the following formula (1): Ln4−x(EuzM1−z)xSi12−yAlyO3+x+yN18−x−y(0.5≦x≦3, 0

Abstract translation: 提供黄色荧光体。 黄色荧光体包括由下式（1）表示的化合物形成的结晶：Ln4-x（EuzM1-z）xSi12-yAlyO3 + x + yN18-x-y（0.5＆nlE; x＆nlE; （1）其中Ln包括选自IIIa族元素和稀土元素中的至少一种，M包括选自钙（Ca），钡（Ba），锶（Sr）和 镁（Mg）。

公开(公告)号：US20240196517A1

公开(公告)日：2024-06-13

申请号：US18585714

申请日：2024-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun JO ,  Dohoon KIM ,  Sangyong KIM ,  Bongkyu MIN ,  Seoyoung PARK ,  Yunoh CHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0219 ,  H05K1/116 ,  H05K1/14 ,  H05K2201/0939 ,  H05K2201/10378

Abstract: Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.

公开(公告)号：US20240107726A1

公开(公告)日：2024-03-28

申请号：US18514331

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K9/0032 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10371 ,  H05K2201/10378

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US20200337188A1

公开(公告)日：2020-10-22

申请号：US16921801

申请日：2020-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US20240414752A1

公开(公告)日：2024-12-12

申请号：US18767540

申请日：2024-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Hyunsoo KIM ,  Seoyoung PARK ,  Minwoo KIM ,  Songkyu KIM ,  Daehee PARK ,  Dohoon KIM ,  Sangyong KIM ,  Youngsun JO

IPC: H04W72/541 ,  H04L5/00 ,  H04W72/0453

Abstract: A method for selecting a mobile industry processor interface (MIPI) frequency, includes: identifying first interference data representing an interference amount between each of multiple communication frequency bands and each of MIPI frequencies; identifying a weight corresponding to each of the MIPI frequencies, based on a communication parameter related to a wireless communication for each of the multiple communication frequency bands; updating the first interference data for each of the MIPI frequencies, based on the identified weight; and selecting the MIPI frequency for operating an MIPI interface, based on the updated first interference data.

公开(公告)号：US20240274581A1

公开(公告)日：2024-08-15

申请号：US18437570

申请日：2024-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon KIM ,  Seungmin KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/49822 ,  H01L2224/08235 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1436 ,  H10B80/00

Abstract: A semiconductor package includes a package substrate, and a first semiconductor chip positioned on the package substrate. The first semiconductor chip includes a first inactive layer and a first active layer. The first inactive layer includes a high-density region, and the high-density region of the first inactive layer has a higher density than densities of other regions of the first inactive layer.

公开(公告)号：US20230201396A1

公开(公告)日：2023-06-29

申请号：US18118591

申请日：2023-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohoon KIM ,  Yosub PARK

IPC: A61L2/24 ,  G05D1/02 ,  H04R1/40 ,  H04R3/00 ,  H04N23/695 ,  G06T7/70 ,  G06V20/50 ,  G06V10/82 ,  G06V40/10 ,  G10L25/66 ,  G10L25/30 ,  H04N7/18 ,  A61L2/18 ,  A61L2/10

CPC classification number: A61L2/24 ,  A61L2/10 ,  A61L2/18 ,  G05D1/0212 ,  G05D1/0231 ,  G05D1/0255 ,  G06T7/70 ,  G06V10/82 ,  G06V20/50 ,  G06V40/10 ,  G10L25/30 ,  G10L25/66 ,  H04N7/188 ,  H04N23/695 ,  H04R1/406 ,  H04R3/005 ,  A61L2202/14 ,  A61L2202/16 ,  G05D2201/0203 ,  G06T2207/20084 ,  G06T2207/30196

Abstract: Provided is a robot comprising a driving part, a camera, a plurality of microphones arranged in different directions. The robot further comprises a memory storing instructions, and a processor configured to execute the instructions to identify an originating direction of an audio signal input through the plurality of microphones based on the audio signal being identified as corresponding to a coughing sound, control the camera to capture an image in the originating direction, identify a sterilization area based on a position of a user who does not wear a mask identified in the image, and control the driving part to move the robot to the sterilization area.

公开(公告)号：US20230155990A1

公开(公告)日：2023-05-18

申请号：US18149460

申请日：2023-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon KIM ,  Sewon PARK ,  Jookyoung PARK

IPC: H04L9/40 ,  H04L5/00

CPC classification number: H04L63/065 ,  H04L5/0055 ,  H04L63/0435

Abstract: An electronic device is provided. The electronic device includes a communication module, a memory, and a server processor operably connected to the communication module and the memory. The server processor acquires, from the first electronic device, a first message encrypted based on first security information about the second electronic device, so as to transmit the first message to the second electronic device, acquires, from the second electronic device, a decryption failure signal for the first message so as to transmit the decryption failure signal to the first electronic device, acquires, from the second electronic device, second security information about the second electronic device so as to transmit same to the first electronic device, receives, from the first electronic device, a second message encrypted based on the second security information, and can transmit the received second message to the second electronic device.

公开(公告)号：US20200348030A1

公开(公告)日：2020-11-05

申请号：US16864839

申请日：2020-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongho SEO ,  Kyunghoon KIM ,  Wooseog SONG ,  Jaehyoung SIM ,  Joonho YOON ,  Donggyu LEE ,  Mingi CHO ,  Dohoon KIM ,  Jinbaek KIM ,  Kisup LEE ,  Donggi HAN

IPC: F24F1/0033 ,  F24F1/0063 ,  F24F1/0022 ,  F24F13/08 ,  F24F13/02 ,  F24F13/30

Abstract: An indoor unit of an air conditioner comprises a housing comprising a first accommodating part and a second accommodating part, a heat exchanger provided in the second accommodating part, extended in a longitudinal direction of the second accommodating part, and configured to exchange heat with a refrigerant transferred from an outdoor unit, a first air-blower and a second air-blower respectively provided in the first accommodating part in a direction parallel to an extension direction of the heat exchanger, and configured to introduce air into the first accommodating part and discharge the introduced air to the second accommodating part, and a guide provided in the second accommodating part, extended from the first accommodating part to the heat exchanger, and configured to guide a flow of air discharged from the first accommodating part to the second accommodating part by at least one of the first air-blower and the second air-blower.