公开(公告)号：US20240414752A1

公开(公告)日：2024-12-12

申请号：US18767540

申请日：2024-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Hyunsoo KIM ,  Seoyoung PARK ,  Minwoo KIM ,  Songkyu KIM ,  Daehee PARK ,  Dohoon KIM ,  Sangyong KIM ,  Youngsun JO

IPC: H04W72/541 ,  H04L5/00 ,  H04W72/0453

Abstract: A method for selecting a mobile industry processor interface (MIPI) frequency, includes: identifying first interference data representing an interference amount between each of multiple communication frequency bands and each of MIPI frequencies; identifying a weight corresponding to each of the MIPI frequencies, based on a communication parameter related to a wireless communication for each of the multiple communication frequency bands; updating the first interference data for each of the MIPI frequencies, based on the identified weight; and selecting the MIPI frequency for operating an MIPI interface, based on the updated first interference data.

公开(公告)号：US20240196517A1

公开(公告)日：2024-06-13

申请号：US18585714

申请日：2024-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun JO ,  Dohoon KIM ,  Sangyong KIM ,  Bongkyu MIN ,  Seoyoung PARK ,  Yunoh CHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0219 ,  H05K1/116 ,  H05K1/14 ,  H05K2201/0939 ,  H05K2201/10378

Abstract: Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.