公开(公告)号：US20240339391A1

公开(公告)日：2024-10-10

申请号：US18745592

申请日：2024-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunoh CHI ,  Sanghoon PARK ,  Wonseob KIM ,  Yongjae SONG ,  Kyungho LEE

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/14

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49838 ,  H05K1/14 ,  H05K2201/10378

Abstract: An electronic device according to various embodiments of the disclosure may include: a first printed circuit board; a second printed circuit board; and an interposer having one surface on which the first printed circuit board is disposed and the other surface on which the second printed circuit board is disposed, wherein the interposer includes: a first via including a first via hole and a first plating layer; a second via including a second via hole having a diameter being increased toward a direction getting away from the first via and a second plating layer coming in contact with the first plating layer, and disposed at one end of the first via; a third via hole having a diameter being increased toward the direction getting away from the first via and a third plating layer coming in contact with the first plating layer.

公开(公告)号：US20240196517A1

公开(公告)日：2024-06-13

申请号：US18585714

申请日：2024-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun JO ,  Dohoon KIM ,  Sangyong KIM ,  Bongkyu MIN ,  Seoyoung PARK ,  Yunoh CHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0219 ,  H05K1/116 ,  H05K1/14 ,  H05K2201/0939 ,  H05K2201/10378

Abstract: Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.

公开(公告)号：US20220304156A1

公开(公告)日：2022-09-22

申请号：US17679735

申请日：2022-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungho LEE ,  Yunoh CHI

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/00

Abstract: An electronic device is provided. The electronic device comprises an interposer disposed between first circuit board and second circuit board, and including an opening area and for accommodating the at least one electronic component, and the interposer comprises a board including an inner surface that faces the opening area and an outer surface that faces an opposite direction to the inner surface, wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first concave areas, and a side conductive member disposed on the first concave areas and the first concave areas of the outer surface, and formed along the convexo-concave form of the outer surface.