摘要:
A semiconductor memory device includes a first signal generation unit configured to sequentially generate first and second delay signals in response to a first column control signal, the first and second delay signals having reflected a delay time and a multiplied delay time selected from a plurality of delay times in correspondence with an arrangement location of a unit memory region, through data is input/output, respectively, and a second signal generation unit configured to generate a second column control signal delayed by the selected delay time as compared with the first column control signal, to determine an activation time point of the second column control signal in response to the first delay signal, and to determine a deactivation time point of the second column control signal in response to the second delay signal.
摘要:
A memory may include first to Nth cell arrays configured to include a plurality of memory cells and one or more first to Nth data input/output pads respectively corresponding to the first to Nth cell arrays, wherein the one or more first to Nth data input/output pads are configured to input/output data to/from the first to Nth cell arrays.
摘要:
An integrated circuit chip includes: one or more couplers suitable for transferring data between stacked chips; one or more data nodes suitable for transferring data to a host; and one or more transfer circuits on a transfer path for transferring data between the one or more couplers and the one or more data nodes, wherein at least one transfer circuit among the one or more transfer circuits inverts a portion of the data which is transferred by the at least one transfer circuit.
摘要:
A semiconductor device includes a through electrode vertically passing through the semiconductor device; a metal pad electrically coupling the through electrode and an exterior; a data input block suitable for transferring a data signal to the metal pad in response to a write command; a through electrode storage block suitable for storing the data signal transferred through the metal pad; and a data output block suitable for outputting the data signal, which is stored in the through electrode storage block, to the exterior in response to a read command.
摘要:
A semiconductor memory device includes a first signal generation unit configured to sequentially generate first and second delay signals in response to a first column control signal, the first and second delay signals having reflected a delay time and a multiplied delay time selected from a plurality of delay times in correspondence with an arrangement location of a unit memory region, through data is input/output, respectively, and a second signal generation unit configured to generate a second column control signal delayed by the selected delay time as compared with the first column control signal, to determine an activation time point of the second column control signal in response to the first delay signal, and to determine a deactivation time point of the second column control signal in response to the second delay signal.
摘要:
A semiconductor system includes a semiconductor chip; a penetrating electrode, which is formed to penetrate the semiconductor chip; two or more metals, which are formed in the upper portion of the penetrating electrode; a bump, which is formed to contact the upper portions of the metals and supplies a data signal inputted from outside to the metals; a detection block suitable for detecting whether or not the bump is coupled with the metals by comparing voltage levels of the metals with each other and generating a decision signal; and a signal output block suitable for outputting the decision signal externally.
摘要:
An integrated circuit includes: one or more first sections in which first to Nth data (where N is an integer equal to or greater than 2) corresponding to one command are transferred through one line; and two or more second sections in which the first to Nth data are serial-to-parallel converted in 1:N and transferred through N lines, wherein whenever the command is applied, the first to Nth data are transferred without being inverted or transferred after being inverted repeatedly in at least one second section among the two or more second sections.
摘要:
A memory may include first to Nth cell arrays configured to include a plurality of memory cells and one or more first to Nth data input/output pads respectively corresponding to the first to Nth cell arrays, wherein the one or more first to Nth data input/output pads are configured to input/output data to/from the first to Nth cell arrays.