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公开(公告)号：US20200181334A1
公开(公告)日：2020-06-11
申请号：US16634931
申请日：2018-06-22
摘要： An organic silicon compound represented by the following general formula (1). An organic silicon compound that can fill a heat conductive filler at the high density and can be used in a curable thermal conductive silicone composition capable of suppressing the strength degradation of the curable thermal conductive silicone composition even when the heat conductive filler is densely filled. (In the formula, R1 represents an alkyl group having 1 to 6 carbon atoms, R2 represents independently a hydrogen atom or a nonsubstituted or substituted monovalent hydrocarbon group, R3 and R4 each represents independently a nonsubstituted or substituted monovalent hydrocarbon group, and R5 represents a hydrogen atom or an alkenyl group, and m represents an integer of 1 to 30, and n represents an integer of 3 to 4.)
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2.发明公开公开(公告)号：US20240199934A1
公开(公告)日：2024-06-20
申请号：US18285913
申请日：2022-02-22
发明人： Yasuhisa ISHIHARA , Akihiro ENDO , Masahiro YODA
IPC分类号： C09K5/14 , C08G77/08 , C08G77/12 , C08G77/20 , C08K3/22 , C08K7/18 , C08K9/06 , C08K13/06 , H05K7/20
CPC分类号： C09K5/14 , C08G77/08 , C08G77/12 , C08G77/20 , C08K13/06 , H05K7/2039 , C08K2003/2227 , C08K7/18 , C08K9/06 , C08K2201/001 , C08K2201/005
摘要： A thermally conductive composite sheet, includes: a thermally conductive sheet containing an organopolysiloxane elastomer and a thermally conductive filler, and having an Asker C hardness of 30 or less, surface tack force of 30 gf or more, a thickness of 0.3 mm or more, and a thermal conductivity of 0.8 W/mK or more; and an insulative resin film having a thickness of 10 μm or more and 50 μm or less and an elastic modulus of 1 GPa or more, wherein the insulative resin film is laminated on one side of the thermally conductive sheet. The thermally conductive composite sheet has high surface slidability so that a heat-generating electronic component can be easily mounted thereon, and also has excellent thermal conductivity.
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公开(公告)号：US20220220354A1
公开(公告)日：2022-07-14
申请号：US17296291
申请日：2019-10-30
摘要： The present invention is a cured material of a thermal conductive silicone composition, the composition containing: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler containing; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 μm or more and having 1 mass % or less of a fine powder with a particle size of 5 μm or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 μm or more, where the component (B-ii) content is 30 to 65 volume %. This provides a cured material of a thermal conductive silicone composition excellent in handling properties and having a high thermal conductivity.
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公开(公告)号：US20210130561A1
公开(公告)日：2021-05-06
申请号：US16480851
申请日：2018-01-16
IPC分类号： C08J7/04 , B29C35/02 , C08J7/044 , C08K3/20 , H01L23/373
摘要： A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
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公开(公告)号：US20190233612A1
公开(公告)日：2019-08-01
申请号：US16316901
申请日：2017-06-09
发明人： Akihiro ENDO , Yasuhisa ISHIHARA , Toru TSUCHIYA , Hisaharu YAMAGUCHI , Masahiro MOTEKI , Takahiro MARUYAMA
IPC分类号： C08K3/22 , B32B27/06 , B32B27/12 , B32B27/20 , B32B27/28 , C08K7/00 , C08L83/06 , H01L23/373
摘要： A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
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公开(公告)号：US20220234335A1
公开(公告)日：2022-07-28
申请号：US17617772
申请日：2020-04-15
发明人： Yasuhisa ISHIHARA , Akihiro ENDO
IPC分类号： B32B25/08 , B32B25/20 , B32B27/28 , B32B7/027 , B32B25/10 , B32B5/02 , B32B7/12 , C09J7/38 , C09J7/25
摘要： A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 μm on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. A thermal conductive composite silicone rubber sheet provided with an adhesive layer on one side of a thermal conductive silicone rubber sheet, makes it possible to impart adhesion without sacrificing thermal conductivity.
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7.发明申请公开(公告)号：US20190316018A1
公开(公告)日：2019-10-17
申请号：US16341838
申请日：2017-10-06
发明人： Takanori ITO , Akihiro ENDO , Yasuhisa ISHIHARA
摘要： Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.
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公开(公告)号：US20170198188A1
公开(公告)日：2017-07-13
申请号：US15315149
申请日：2015-05-25
IPC分类号： C09K5/14 , H01L23/373 , C09D183/04
CPC分类号： C09K5/14 , C08K3/22 , C08K7/18 , C08K2003/2227 , C08L83/04 , C09D183/04 , H01L23/36 , H01L23/373 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , H05K7/20 , H01L2924/00
摘要： A thermally conductive sheet including a glass cloth filled with a thermally conductive resin composition, one or both surfaces of the glass cloth being layered with a cured, thermally conductive silicone composition, wherein the thermally conductive silicone composition comprises a silicone component and thermally conductive filler (C) of an amount of 1,200 to 2,000 parts by mass, relative to 100 parts by mass of the silicone component, the thermally conductive filler (C) has an average particle size smaller than 15 μm, and an amount of particles having a particle size of 45 μm or larger is 0 to 3 mass % and an amount of particles having a particle size of 75 μm or larger is 0 to 0.01 mass %, based on an amount of the thermally conductive filler (C).
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公开(公告)号：US20210355363A1
公开(公告)日：2021-11-18
申请号：US17281135
申请日：2019-08-05
摘要： A thermal conductive silicone composition containing: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms, the moles of hydrogen atoms directly bonded to silicon atoms is 0.1-5.0 times the moles of alkenyl groups derived from the component (A); (C) 2,800-4,000 parts by mass of a heat conductive filler including 50 mass % or more of a mixture of 25-35 mass % of aluminum hydroxide having an average particle size of 0.1 μm or more and less than 40 μm and 65-75 mass % of aluminum hydroxide having an average particle size of 40 μm or more and 100 μm or less; and (D) a platinum group metal-based curing catalyst having a mass-based platinum group metal element content of 0.1-1,000 ppm relative to the component (A).
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公开(公告)号：US20190256756A1
公开(公告)日：2019-08-22
申请号：US16342785
申请日：2017-10-05
发明人： Yasuhisa ISHIHARA , Akihiro ENDO
摘要： A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.
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