A thermal conductive silicone composition containing: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms, the moles of hydrogen atoms directly bonded to silicon atoms is 0.1-5.0 times the moles of alkenyl groups derived from the component (A); (C) 2,800-4,000 parts by mass of a heat conductive filler including 50 mass % or more of a mixture of 25-35 mass % of aluminum hydroxide having an average particle size of 0.1 μm or more and less than 40 μm and 65-75 mass % of aluminum hydroxide having an average particle size of 40 μm or more and 100 μm or less; and (D) a platinum group metal-based curing catalyst having a mass-based platinum group metal element content of 0.1-1,000 ppm relative to the component (A).