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公开(公告)号：US20220403113A1
公开(公告)日：2022-12-22
申请号：US17775173
申请日：2020-10-27
发明人： Junichi TSUKADA , Takanori ITO , Akihiro ENDO , Megumi MIYANO
摘要： Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.
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2.发明申请SILICONE ADHESIVE SHEET HAVING ULTRAVIOLET RAY SHIELDING PROPERTIES FOR SEALING SOLAR CELL AND SOLAR CELL MODULE USING SAME 审中-公开具有使用相同密封太阳能电池和太阳能电池模块的ULTRAVIOLET RAY SHIELDING特性的硅胶片公开(公告)号：US20160300969A1
公开(公告)日：2016-10-13
申请号：US15035625
申请日：2014-10-30
发明人： Naoki YAMAKAWA , Minoru IGARASHI , Atsushi YAGINUMA , Tomoyoshi FURIHATA , Hiroto OHWADA , Junichi TSUKADA , Atsuo ITO
IPC分类号： H01L31/048 , C09J183/08 , C09J9/00 , C09J183/06
CPC分类号： H01L31/0481 , C08G77/12 , C08G77/20 , C08K3/22 , C08K3/36 , C08K5/56 , C08L83/00 , C09J9/00 , C09J183/04 , C09J183/06 , C09J183/08 , Y02E10/50
摘要： This silicone adhesive sheet, which has ultraviolet ray shielding properties and is for sealing a solar cell, and which forms a silicone adhesive layer contacting a back surface panel in a solar cell module provided with a light-receiving surface panel, a back surface panel, a silicone adhesive layer contacting both surface panels, and a plurality of solar cells that are sealed by being interposed between both adhesive layers, is characterized by imparting a light transmission rate of no greater than 30% when measuring the light transmission rate at a wavelength of 380 nm to a cured product having a thickness of 2 mm. The silicone adhesive sheet is of a millable type able to capable of extrusion molding, calendering molding, and the like, and modularization using a vacuum laminator is possible of a laminate of a light-receiving surface panel, a silicone adhesive sheet, a solar cell, the silicone adhesive sheet of the present invention, and a back surface panel (back sheet).
摘要翻译： 这种具有紫外线屏蔽性并且用于密封太阳能电池的硅氧烷粘合片，并且在设置有受光面板，背面面板，背面面板的太阳能电池模块中形成与背面面板接触的硅氧烷粘合剂层， 接触两个表面面板的硅氧烷粘合剂层和通过插入在两个粘合剂层之间被密封的多个太阳能电池，其特征在于当测量波长的光透射率时，透光率不大于30％ 380nm到厚度为2mm的固化产物。 硅酮粘合片是能够挤出成型，压延成型等的可碾磨型，并且使用真空层压机的模块化可以是受光面板，硅树脂粘合片，太阳能电池的叠层 ，本发明的硅酮粘合片和背面面板（背面片）。
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公开(公告)号：US20240294758A1
公开(公告)日：2024-09-05
申请号：US18566236
申请日：2022-05-31
发明人： Junichi TSUKADA
IPC分类号： C08L83/04 , C08K5/3475
CPC分类号： C08L83/04 , C08K5/3475 , C08K2201/001
摘要： Provided is a thermally conductive silicone composition capable of being turned into a cured product that is superior in heat dissipation property and is able to suppress corrosion of metal wirings. The thermally conductive silicone composition contains:
(A) an organopolysiloxane having at least 2 silicon atom-bonded alkenyl groups per molecule, and having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.;
(B) an organohydrogenpolysiloxane having, per molecule, at least 2 hydrogen atoms that are directly bonded to silicon atoms;
(C) a thermally conductive filler having a thermal conductivity of not lower than 10 W/m·K;
(D) a dimethylpolysiloxane with one molecular chain end being blocked by a trialkoxy group;
(E) a platinum group metal-based curing catalyst;
(F) benzotriazole and/or a benzotriazole derivative; and
(G) an aliphatic unsaturated bond-free organopolysiloxane.-
公开(公告)号：US20210355363A1
公开(公告)日：2021-11-18
申请号：US17281135
申请日：2019-08-05
摘要： A thermal conductive silicone composition containing: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms, the moles of hydrogen atoms directly bonded to silicon atoms is 0.1-5.0 times the moles of alkenyl groups derived from the component (A); (C) 2,800-4,000 parts by mass of a heat conductive filler including 50 mass % or more of a mixture of 25-35 mass % of aluminum hydroxide having an average particle size of 0.1 μm or more and less than 40 μm and 65-75 mass % of aluminum hydroxide having an average particle size of 40 μm or more and 100 μm or less; and (D) a platinum group metal-based curing catalyst having a mass-based platinum group metal element content of 0.1-1,000 ppm relative to the component (A).
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