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公开(公告)号：US20210130561A1
公开(公告)日：2021-05-06
申请号：US16480851
申请日：2018-01-16
IPC分类号： C08J7/04 , B29C35/02 , C08J7/044 , C08K3/20 , H01L23/373
摘要： A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
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公开(公告)号：US20190233612A1
公开(公告)日：2019-08-01
申请号：US16316901
申请日：2017-06-09
发明人： Akihiro ENDO , Yasuhisa ISHIHARA , Toru TSUCHIYA , Hisaharu YAMAGUCHI , Masahiro MOTEKI , Takahiro MARUYAMA
IPC分类号： C08K3/22 , B32B27/06 , B32B27/12 , B32B27/20 , B32B27/28 , C08K7/00 , C08L83/06 , H01L23/373
摘要： A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
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