公开(公告)号：US09449856B2

公开(公告)日：2016-09-20

申请号：US14334060

申请日：2014-07-17

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Tomoaki Nakamura ,  Toshio Shiobara ,  Hideki Akiba ,  Susumu Sekiguchi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/265 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31855 ,  H01L2924/00

Abstract: The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured.

Abstract translation: 本发明提供一种具有用于半导体封装的基底的密封剂，用于集体封装其上安装有半导体器件的衬底的器件安装表面或形成半导体器件的晶片的器件形成表面，该密封剂包括 基体，由形成在基材的一个表面上的未固化或半固化的热固性树脂构成的封装树脂层和形成在基材的另一个表面上的表面树脂层。 密封剂使得能够制造具有良好外观和激光打标性能的半导体装置。

公开(公告)号：US09287174B2

公开(公告)日：2016-03-15

申请号：US14080319

申请日：2013-11-14

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Susumu Sekiguchi ,  Toshio Shiobara ,  Hideki Akiba ,  Tomoaki Nakamura

IPC: H01L23/29 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  C03C25/26 ,  C08J5/08

CPC classification number: H01L21/78 ,  B32B5/022 ,  B32B27/12 ,  B32B27/20 ,  B32B27/283 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/105 ,  B32B2262/106 ,  B32B2264/10 ,  B32B2307/306 ,  B32B2307/7265 ,  B32B2439/00 ,  B32B2457/14 ,  C03C25/26 ,  C03C25/36 ,  C08J5/043 ,  C08J5/08 ,  C08J5/24 ,  C08J7/047 ,  C08J2363/04 ,  C08J2463/00 ,  H01L21/561 ,  H01L21/565 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/97 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T442/2041 ,  H01L2224/83 ,  H01L2924/00

Abstract: A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material.

Abstract translation: 一种用于共同封装其上安装有半导体器件的衬底的半导体器件安装表面或其上形成半导体器件的晶片的半导体器件形成表面的含纤维树脂衬底，包括树脂浸渍的纤维 基材，其通过用热固性树脂浸渍纤维基材并半固化或固化该热固性树脂而获得，并且在XY方向上的线膨胀系数（ppm /℃）小于3ppm，并且未固化 在树脂浸渍的纤维基材的一侧上由未固化的热固性树脂形成的树脂层。

公开(公告)号：US10385203B2

公开(公告)日：2019-08-20

申请号：US15691189

申请日：2017-08-30

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kazuaki Sumita ,  Tomoaki Nakamura ,  Naoyuki Kushihara

IPC: C08L61/06 ,  C08K9/06 ,  C08K5/17 ,  C08K3/36 ,  H01L21/56 ,  H01L23/29 ,  C08G73/06 ,  C08G14/12

Abstract: Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer.The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.

公开(公告)号：US09312197B2

公开(公告)日：2016-04-12

申请号：US14738342

申请日：2015-06-12

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hideki Akiba ,  Tomoaki Nakamura ,  Shinsuke Yamaguchi ,  Toshio Shiobara

IPC: H01L23/29 ,  B32B27/28 ,  B32B27/38 ,  B32B27/12 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/296 ,  B32B3/08 ,  B32B5/024 ,  B32B5/26 ,  B32B27/12 ,  B32B27/16 ,  B32B27/283 ,  B32B27/38 ,  B32B2305/77 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/712 ,  B32B2307/7265 ,  B32B2310/14 ,  B32B2457/14 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3135 ,  H01L24/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated. The support base-attached encapsulant has uniformity and homogeneity without opening or tangle of fiber, and is excellent in reliability such as heat resistance, electrical insulation property, moisture resistance, excellent in versatility, economical efficiency, and mass-productivity.

Abstract translation: 支撑基底附着的密封剂，用于共同封装形成表面的基板或半导体器件的半导体器件安装表面，所述晶片的半导体器件安装表面包含具有一个纤维膜的支撑基底或多个被层压的纤维膜，经受表面处理的纤维膜 和有机硅化合物，以及在支撑基体的一个表面上形成的热固性树脂的树脂层。 支撑基底附着的密封剂抑制基板或晶片从翘曲和半导体器件剥离基板，并且即使当大直径晶片也被共同封装衬底的半导体器件安装表面或晶片的半导体器件形成表面时 或大面积衬底被封装。 支撑基附着密封剂具有均匀性和均匀性，而不会导致纤维的开裂或缠结，并且具有优异的可靠性，例如耐热性，电绝缘性，耐湿性，通用性，经济效率和批量生产率。

公开(公告)号：US10177059B2

公开(公告)日：2019-01-08

申请号：US15490016

申请日：2017-04-18

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Tomoaki Nakamura ,  Hideki Akiba ,  Toshio Shiobara

IPC: H01L21/56 ,  H01L23/29 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00

Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient α1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient α2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient α3 of the base satisfy both of the following formula (1) and (2); α1

公开(公告)号：US10242924B2

公开(公告)日：2019-03-26

申请号：US15715455

申请日：2017-09-26

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Tomoaki Nakamura ,  Hideki Akiba ,  Toshio Shiobara

IPC: H01L21/56 ,  H01L23/29 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00

Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient α1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient α2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient α3 of the base satisfy both of the following formula (1) and (2); α1

公开(公告)号：US09865518B2

公开(公告)日：2018-01-09

申请号：US14872973

申请日：2015-10-01

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hideki Akiba ,  Tomoaki Nakamura ,  Toshio Shiobara ,  Shinsuke Yamaguchi

IPC: H01L23/06 ,  H01L23/552 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  C09J7/02

CPC classification number: H01L23/06 ,  C09J7/28 ,  C09J7/29 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2400/163 ,  H01L21/561 ,  H01L21/78 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/01047

Abstract: The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency.

公开(公告)号：US09129912B2

公开(公告)日：2015-09-08

申请号：US14066212

申请日：2013-10-29

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hideki Akiba ,  Toshio Shiobara ,  Susumu Sekiguchi ,  Tomoaki Nakamura

IPC: H01L23/29 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/565 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10T428/2495 ,  Y10T428/24967 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.

Abstract translation: 本发明提供了一种密封剂，用于共同封装具有安装在其上的半导体器件的衬底的半导体器件安装表面或形成其上形成有半导体器件的晶片表面的半导体器件，并且该密封剂包括具有线性膨胀差 系数与基板或晶片的系数为5ppm以下，热固化性树脂层层叠，其中，热固性树脂层具有与厚度方向的高度差的形状。