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公开(公告)号：US10669197B2
公开(公告)日：2020-06-02
申请号：US14564190
申请日：2014-12-09
IPC分类号： D06M13/513 , C03C25/1095 , C03C25/50
摘要： The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film.There can be provided a surface-modified glass fiber film having a high strength, a high heat resistance, a good dimensional stability, a good self-supporting property, a low average linear expansion coefficient, a high storage rigidity at high temperature, and an excellent surface uniformity.
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2.发明授权Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus 有权支撑基底密封剂，其上安装有半导体器件的封装衬底，其上形成有半导体器件的封装晶片，半导体器件和半导体器件的制造方法公开(公告)号：US09312197B2
公开(公告)日：2016-04-12
申请号：US14738342
申请日：2015-06-12
CPC分类号： H01L23/296 , B32B3/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B27/16 , B32B27/283 , B32B27/38 , B32B2305/77 , B32B2307/206 , B32B2307/306 , B32B2307/712 , B32B2307/7265 , B32B2310/14 , B32B2457/14 , H01L21/561 , H01L21/78 , H01L23/3135 , H01L24/97 , H01L2924/181 , H01L2924/00012
摘要： Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated. The support base-attached encapsulant has uniformity and homogeneity without opening or tangle of fiber, and is excellent in reliability such as heat resistance, electrical insulation property, moisture resistance, excellent in versatility, economical efficiency, and mass-productivity.
摘要翻译： 支撑基底附着的密封剂，用于共同封装形成表面的基板或半导体器件的半导体器件安装表面，所述晶片的半导体器件安装表面包含具有一个纤维膜的支撑基底或多个被层压的纤维膜，经受表面处理的纤维膜 和有机硅化合物，以及在支撑基体的一个表面上形成的热固性树脂的树脂层。 支撑基底附着的密封剂抑制基板或晶片从翘曲和半导体器件剥离基板，并且即使当大直径晶片也被共同封装衬底的半导体器件安装表面或晶片的半导体器件形成表面时 或大面积衬底被封装。 支撑基附着密封剂具有均匀性和均匀性，而不会导致纤维的开裂或缠结，并且具有优异的可靠性，例如耐热性，电绝缘性，耐湿性，通用性，经济效率和批量生产率。
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公开(公告)号：US10600707B2
公开(公告)日：2020-03-24
申请号：US16040850
申请日：2018-07-20
IPC分类号： H01L23/31 , H01L21/56 , H01L21/78 , H01L23/29 , B29C70/68 , C08L63/00 , C08G59/62 , C08G59/40 , C08G59/24 , B29L31/34 , B29C70/70 , B29K63/00 , B29C70/08
摘要： A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
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公开(公告)号：US09865518B2
公开(公告)日：2018-01-09
申请号：US14872973
申请日：2015-10-01
CPC分类号： H01L23/06 , C09J7/28 , C09J7/29 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2400/163 , H01L21/561 , H01L21/78 , H01L23/29 , H01L23/295 , H01L23/3121 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/94 , H01L24/97 , H01L2224/13111 , H01L2224/16227 , H01L2224/97 , H01L2924/0002 , H01L2924/10253 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2924/01047
摘要： The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency.
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