公开(公告)号：US20180269834A1

公开(公告)日：2018-09-20

申请号：US15914606

申请日：2018-03-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hisahiro ITO ,  Tetsuya OTSUKI ,  Mitsuaki SAWADA

IPC: H03B5/32 ,  H03H9/10 ,  H03H9/05 ,  H03H9/19

CPC classification number: H03B5/32 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/83469 ,  H01L2224/83478 ,  H01L2224/83484 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03B1/02 ,  H03H9/0514 ,  H03H9/0542 ,  H03H9/10 ,  H03H9/1021 ,  H03H9/19 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

公开(公告)号：US20160293827A1

公开(公告)日：2016-10-06

申请号：US15086620

申请日：2016-03-31

Applicant: Seiko Epson Corporation

Inventor： Tetsuya OTSUKI ,  Shiro MURAKAMI ,  Tomohiro ARAI ,  Mitsuhiro WADA ,  Hiroshi ITO ,  Manabu SHIRAKI ,  Manabu KONDO ,  Muneyoshi HAMA

IPC: H01L41/047 ,  H03H9/215 ,  H01L41/29 ,  C23C14/18 ,  C23C14/34

CPC classification number: H01L41/0477 ,  C23C14/0036 ,  C23C14/025 ,  C23C14/0641 ,  C23C14/185 ,  H01L41/29 ,  H03H9/02023 ,  H03H9/0509 ,  H03H9/0514 ,  H03H9/0519 ,  H03H9/0547 ,  H03H9/131 ,  H03H9/171 ,  H03H9/215

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Abstract translation: 电子设备包括基材，设置在基材上并含有氮和铬的第一金属膜和设置在第一金属膜上并含有金的第二金属膜。 在第一金属膜中，氮原子数可以是铬原子数的20％至100％。 此外，第一金属膜中的氮原子的分布在夹在第一金属膜的基材侧的第一区域和第二金属膜侧的第二区域之间的第三区域比在第一区域中分布更大， 第二个地区。

公开(公告)号：US20150070855A1

公开(公告)日：2015-03-12

申请号：US14482290

申请日：2014-09-10

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Tetsuya OTSUKI ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Hidefumi NAKAMURA

IPC: H05K3/38 ,  H05K3/46 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/388 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K2203/1131

Abstract: A circuit board includes a ceramics substrate composed of ceramics and a conductor portion provided on the ceramics substrate. The conductor portion is composed of a stacked body including, in order from the ceramics substrate side, an under layer that contains a Group 6 element and a glass material, and a metal layer that contains a low-melting-point metal. A portion of the low-melting-point metal constituting the metal layer migrates to the under layer.

Abstract translation: 电路板包括由陶瓷构成的陶瓷基板和设置在陶瓷基板上的导体部。 导体部由层叠体构成，该层叠体从陶瓷基板侧依次包括含有第6族元素和玻璃材料的底层，以及含有低熔点金属的金属层。 构成金属层的部分低熔点金属迁移到下层。

公开(公告)号：US20130322046A1

公开(公告)日：2013-12-05

申请号：US13962428

申请日：2013-08-08

Applicant: SEIKO EPSON CORPORATION

Inventor： Tetsuya OTSUKI

IPC: H05K7/14

CPC classification number: H01L23/49575 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.

Abstract translation: 一种制造电子装置的方法，所述方法包括：制备具有第一引线的第一引线框架，所述第一引线具有位于第一区域中的第一部分; 电连接第一引线和第一电子部件; 弯曲所述第一引线使得所述第一部分位于所述第一区域的外部; 布置第二引线框架以与第一引线框架重叠，使得第二引线框架的第二引线的第二部分位于第一区域中; 并且电连接第二引线和第二电子部件。

公开(公告)号：US20190165732A1

公开(公告)日：2019-05-30

申请号：US16199846

申请日：2018-11-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hisahiro ITO ,  Tetsuya OTSUKI ,  Shoichiro KASAHARA

IPC: H03B5/32 ,  H03H9/215 ,  H01L23/495

Abstract: An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

公开(公告)号：US20230040197A1

公开(公告)日：2023-02-09

申请号：US17967927

申请日：2022-10-18

Applicant: SEIKO EPSON CORPORATION

Inventor： Tetsuya OTSUKI ,  Tsugio IDE

IPC: H03H9/215 ,  H03H9/05 ,  H03H9/17 ,  B81B3/00 ,  H03H9/02 ,  H03H3/007 ,  H03L1/04 ,  H03L1/02 ,  G01C19/5621 ,  G01C19/56 ,  H03B5/32 ,  H03H9/10 ,  H03H9/19 ,  B81B7/00

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

公开(公告)号：US20200254663A1

公开(公告)日：2020-08-13

申请号：US16783431

申请日：2020-02-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka KAZUNO ,  Tetsuya OTSUKI

IPC: B29C45/14 ,  H05K5/06 ,  G01P3/44

Abstract: A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

公开(公告)号：US20200235717A1

公开(公告)日：2020-07-23

申请号：US16839125

申请日：2020-04-03

Applicant: Seiko Epson Corporation

Inventor： Tetsuya OTSUKI ,  Tsugio IDE

IPC: H03H9/215 ,  H03L1/04 ,  B81B7/00 ,  H03H9/10 ,  H03H9/05 ,  G01C19/5621 ,  H03H9/19 ,  H03H9/02 ,  H03H9/17 ,  H03H3/007 ,  H03L1/02 ,  B81B3/00 ,  G01C19/56 ,  H03B5/32

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

公开(公告)号：US20160021752A1

公开(公告)日：2016-01-21

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/18 ,  H05K5/00 ,  C04B41/88

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

Abstract translation: 封装基座包括封装体基体和在封装基体上以平面图形式设置成框状或环形的接合金属层，其中，接合金属层含有含有Ti-Ag-Cu的合金和属于金属的金属 到周期表中的第6组。

公开(公告)号：US20190162745A1

公开(公告)日：2019-05-30

申请号：US16194851

申请日：2018-11-19

Applicant: Seiko Epson Corporation

Inventor： Tetsuya OTSUKI ,  Masataka KAZUNO

IPC: G01P1/02 ,  G05D1/08 ,  B60W30/02

Abstract: A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.