Semiconductor device
    1.
    发明授权

    公开(公告)号:US12272606B2

    公开(公告)日:2025-04-08

    申请号:US18300983

    申请日:2023-04-14

    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate including an active pattern, a gate electrode extending in a first direction and crossing the active pattern which extends in a second direction, a separation structure crossing the active pattern and extending in the first direction, a first gate dielectric pattern disposed on a side surface of the gate electrode, a second gate dielectric pattern disposed on a side surface of the separation structure, and a gate capping pattern covering a top surface of the gate electrode. A level of a top surface of the separation structure is higher than a level of a top surface of the gate capping pattern.

    AMPLIFIER CAPABLE OF CANCELING LEAKAGE COMPONENTS

    公开(公告)号:US20240120884A1

    公开(公告)日:2024-04-11

    申请号:US18216766

    申请日:2023-06-30

    CPC classification number: H03F1/0205 H03F3/45269 H03F2200/451

    Abstract: Disclosed is an amplifier that includes a first-first (1-1) transistor and a first-second (1-2) transistor to which differential input signals are applied to gate terminals, respectively; a second-first (2-1) transistor including: one end connected to the 1-1 transistor, a gate terminal configured to receive an operating signal, and the other end configured to output one of differential output signals; a second-second (2-2) transistor including: one end connected to the 1-2 transistor, a gate terminal configured to receive the operating signal, and the other end configured to output the other one of the differential output signals; and a switch connected to one end of the 1-1 transistor and one end of the 1-2 transistor. The switch is configured to turn on based on the 1-1 transistor, the 1-2 transistor, the 2-1 transistor, and the 2-2 transistor being turned off.

    PARALLEL-SERIES COMBINER AND POWER AMPLIFIER INCLUDING THE SAME

    公开(公告)号:US20250150047A1

    公开(公告)日:2025-05-08

    申请号:US18907160

    申请日:2024-10-04

    Abstract: A combiner includes a first unit combiner including a first primary winding connected to a first input terminal, a second primary winding connected to a second input terminal, and a first secondary winding having first and second end portions, the first end portion connected to an output terminal, wherein the first primary winding, the second primary winding, and the first secondary winding are stacked and form a first loop, a second unit combiner including a third primary winding connected to a third input terminal, a fourth primary winding connected to a fourth input terminal, and a second secondary winding having third and fourth end portions, the third end portion connected to the output terminal, wherein the third primary winding, the fourth primary winding, and the second secondary winding are stacked and form a second loop, and a third secondary winding connected between the first and fourth end portions.

    PHASE-LOCKED LOOP CIRCUIT, PHASE ERROR SIGN GENERATOR AND RFIC

    公开(公告)号:US20250070790A1

    公开(公告)日:2025-02-27

    申请号:US18808348

    申请日:2024-08-19

    Abstract: A phase-locked loop (PLL) circuit includes a voltage-controlled oscillator configured to generate an output clock signal of the PLL circuit, a phase detector configured to generate a phase error signal representing a phase difference between a first clock signal based on a reference clock signal and a second clock signal based on the output clock signal, a comparator configured to generate a phase error sign signal based on a reference voltage and the phase error signal, and a reference voltage generation circuit configured to scale first and second sign values of the phase error sign signal based on a fixed gain value and a variable gain value, respectively, and generate the reference voltage based on the scaled first and second sign values.

    CMOS CHIP AND ELECTRONIC DEVICE INCLUDING THE CMOS CHIP

    公开(公告)号:US20230308123A1

    公开(公告)日:2023-09-28

    申请号:US18063301

    申请日:2022-12-08

    CPC classification number: H04B1/0458 H03H7/38 H04B1/0483 H04B1/18

    Abstract: A CMOS chip includes a signal converting circuit configured to convert a baseband signal and an RF signal, a plurality of ports through which the RF signal is transmitted or received, the plurality of ports being respectively included in a first transmission path, a second transmission path, and a reception path, and a plurality of matching networks connected to the signal converting circuit, the plurality of matching networks being respectively connected to the plurality of ports, a first matching network among the plurality of matching networks including an external matching network, and the external matching network being configured to perform an impedance matching of a compound semiconductor device.

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