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    TRANSCEIVER USING ACTIVE DEVICE ARRAY AND ANTENNA MODULE INCLUDING THE SAME
    1.
    发明申请
    TRANSCEIVER USING ACTIVE DEVICE ARRAY AND ANTENNA MODULE INCLUDING THE SAME 有权

    公开(公告)号：US20210351797A1

    公开(公告)日：2021-11-11

    申请号：US17379461

    申请日：2021-07-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

    IPC: H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

    Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

    TRANSCEIVER USING ACTIVE DEVICE ARRAY AND ANTENNA MODULE INCLUDING THE SAME
    3.
    发明申请
    TRANSCEIVER USING ACTIVE DEVICE ARRAY AND ANTENNA MODULE INCLUDING THE SAME 有权

    公开(公告)号：US20210028797A1

    公开(公告)日：2021-01-28

    申请号：US16743478

    申请日：2020-01-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

    IPC: H04B1/00 ,  H01Q21/00 ,  H01L23/498 ,  H05K1/02

    Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

    Transceiver using active device and antenna module including the same
    4.
    发明授权
    Transceiver using active device and antenna module including the same 有权

    公开(公告)号：US12074630B2

    公开(公告)日：2024-08-27

    申请号：US17874717

    申请日：2022-07-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngmin Kim ,  Hongjong Park ,  Iljin Lee

    IPC: H04B1/401 ,  H03K17/687

    CPC classification number: H04B1/401 ,  H03K17/6872

    Abstract: A transceiver includes a first integrated circuit, a second integrated circuit and an antenna array. The first integrated circuit including a transmission chain, a reception chain, and a control circuit, the transmission chain configured to transmit a first radio frequency (RF) signal and the reception chain configured to receive a second RF signal, and the control circuit configured to selectively ground any one of the transmission chain and the reception chain according to a transmission mode or a reception mode; the second integrated circuit including an active device connected to the transmission chain and the reception chain; and the antenna array including an antenna connected to the active device.

    Communication device and operating method thereof
    6.
    发明授权
    Communication device and operating method thereof 有权

    公开(公告)号：US11863226B2

    公开(公告)日：2024-01-02

    申请号：US17661080

    申请日：2022-04-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngmin Kim ,  Hongjong Park ,  Iljin Lee

    IPC: H04B1/40 ,  H04L27/26 ,  H04B1/04

    CPC classification number: H04B1/40 ,  H04B1/0475 ,  H04L27/2636

    Abstract: The present disclosure provides a communication device and an operating method. The communication device includes an antenna, a transmission processor, a radio frequency chain, and a reception processor. The transmission processor is configured to output a second transmission input signal with the same average power as the average power of a first transmission input signal and a second amplitude greater than a first amplitude of the first transmission input signal. The RF chain is configured to output an RF output signal to be transmitted through the antenna, based on a transmission input signal, and to output a reception input signal based on a signal received through the antenna. The reception processor is configured to check an out-of-band blocker by detecting a peaked frequency spectrum based on the reception input signal and to adjust a reception characteristic parameter of the RF chain based on an amplitude of the peaked frequency spectrum.

    CMOS CHIP AND ELECTRONIC DEVICE INCLUDING THE CMOS CHIP
    7.
    发明公开
    CMOS CHIP AND ELECTRONIC DEVICE INCLUDING THE CMOS CHIP 审中-公开

    公开(公告)号：US20230308123A1

    公开(公告)日：2023-09-28

    申请号：US18063301

    申请日：2022-12-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngmin KIM ,  Hongjong Park ,  Sangmin Yoo ,  Sangwook Han

    IPC: H04B1/04 ,  H04B1/18 ,  H03H7/38

    CPC classification number: H04B1/0458 ,  H03H7/38 ,  H04B1/0483 ,  H04B1/18

    Abstract: A CMOS chip includes a signal converting circuit configured to convert a baseband signal and an RF signal, a plurality of ports through which the RF signal is transmitted or received, the plurality of ports being respectively included in a first transmission path, a second transmission path, and a reception path, and a plurality of matching networks connected to the signal converting circuit, the plurality of matching networks being respectively connected to the plurality of ports, a first matching network among the plurality of matching networks including an external matching network, and the external matching network being configured to perform an impedance matching of a compound semiconductor device.

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