摘要:
An integrated circuit including a plurality of standard cells is provided. The integrated circuit includes a first standard cell group including at least two first standard cells, a second standard cell group adjacent to the first standard cell group in a first direction, the second standard cell group including at least one second standard cell, and a first insulating gate bordered by one side of at least one of the first standard cells and one side of the at least one second standard cell, wherein each of the first and second standard cells includes a p-type transistor (pFET) and an n-type transistor (nFET) which are integrated, wherein each of the first and second standard cells has first wiring lines of different designs, and wherein each of the first and second standard cells has the same or different placement of an active region according to the corresponding design.
摘要:
A method includes placing standard cells based on a standard cell library and generating layout data, and placing a filler cell selected from among a first type filler cell and a second type filler cell by using the layout data. The filler cell is placed based on a density of a pattern formed in the standard cell. The standard cell library includes data defining the first and second type filler cells. A density of a contact formed on an active region of the second type filler cell to contact the active region of the second type filler cell is lower than a density of a contact formed on an active region of a first type filler cell to contact the active region of the first type filler cell.
摘要:
A semiconductor device includes a substrate including a first active region and a second active region, the first active region having a conductivity type that is different than a conductivity type of the second active region, and the first active region being spaced apart from the second active region in a first direction, gate electrodes extending in the first direction, the gate electrodes intersecting the first active region and the second active region, a first shallow isolation pattern disposed in an upper portion of the first active region, the first shallow isolation pattern extending in the first direction, and a deep isolation pattern disposed in an upper portion of the second active region, the deep isolation pattern extending in the first direction, and the deep isolation pattern dividing the second active region into a first region and a second region.
摘要:
A design layout includes a set of active region-level design shapes representing semiconductor active regions, and a set of gate-level design shapes representing gate lines straddling the semiconductor active regions. The set of gate-level design shapes include a sub-resolution assist feature (SRAF) that connects two gate-level design shapes, and is physically manifested as a gap between two gate lines upon printing employing lithographic methods. An edge of a gate line in proximity to a semiconductor active region can be cut employing a cut mask that includes a cut-level design shape that has a protruding tap. The protruding tap allows reliable removal of an end portion of a gate line and prevents disruption of raised source and drain regions by an unwanted residual gate structure.
摘要:
A design layout includes a set of active region-level design shapes representing semiconductor active regions, and a set of gate-level design shapes representing gate lines straddling the semiconductor active regions. The set of gate-level design shapes include a sub-resolution assist feature (SRAF) that connects two gate-level design shapes, and is physically manifested as a gap between two gate lines upon printing employing lithographic methods. An edge of a gate line in proximity to a semiconductor active region can be cut employing a cut mask that includes a cut-level design shape that has a protruding tap. The protruding tap allows reliable removal of an end portion of a gate line and prevents disruption of raised source and drain regions by an unwanted residual gate structure.
摘要:
A semiconductor device is provided. The semiconductor device includes a first-direction plurality of wirings extending in a first direction, and a second-direction plurality of wiring extending in a second direction intersecting the first direction. The first-direction plurality of wirings that extend in the first direction includes gate wirings spaced apart from each other in the second direction by a gate pitch, first wirings above the gate wirings spaced apart from each other in the second direction by a first pitch, second wirings above the first wirings spaced apart from each other in the second direction by a second pitch, and third wirings above the second wirings spaced apart from each other in the second direction by a third pitch. A ratio between the gate pitch and the second pitch is 6:5.
摘要:
A semiconductor device includes a substrate having an active region, a first group of standard cells arranged in a first row on the active region of the substrate and having a first height defined in a column direction, a second group of standard cells arranged in a second row on the active region of the substrate, and having a second height, and a plurality of power lines extending in a row direction and respectively extending along boundaries of the first and the second groups of standard cells. The first and second groups of standard cells each further include a plurality of wiring lines extending in the row direction and arranged in the column direction, and at least some of wiring lines in at least one standard cell of the first and second groups of standard cells are arranged at different spacings and/or pitches.
摘要:
Integrated circuits including abutted blocks and methods of designing layouts of the integrated circuits are disclosed. The integrated circuit includes a first block having a first function cell array therein, which is at least partially surrounded by a first plurality of finishing cells, and a second block extending adjacent the first block. The second block includes a second function cell array therein, which is at least partially surrounded by a second plurality of finishing cells. The first plurality of finishing cells include: (i) a first finishing cell placed at a boundary of the integrated circuit, and (ii) a second finishing cell different from the first finishing cell, which is placed at a boundary between the first block and the second block.
摘要:
A semiconductor device includes a substrate including an N-stack cell, a buffer cell and an M-stack cell that are on the substrate, the buffer cell being between the N-stack and M-stack cells, an active pattern extending from the N-stack cell to the M-stack cell via the buffer cell, an N-stack channel pattern on the active pattern of the N-stack cell, an M-stack channel pattern on the active pattern of the M-stack cell, a dummy channel pattern on the active pattern of the buffer cell, an N-stack epitaxial pattern between the N-stack channel pattern and the dummy channel pattern, and an M-stack epitaxial pattern between the M-stack channel pattern and the dummy channel pattern. The N-stack channel pattern includes stacked N semiconductor patterns. The M-stack channel pattern includes stacked M semiconductor patterns. Each of N and M is an integer number of 2 or more, and M is greater than N.
摘要:
A semiconductor device includes a first logic gate defined within a first unit cell footprint on a semiconductor substrate. The first logic gate includes a first field effect transistor including a first gate electrode and a first source/drain region, and a second field effect transistor including a second gate electrode and a second source/drain region. A first wiring pattern is provided, which extends in a first direction across a portion of the first unit cell footprint. The first wiring pattern is electrically connected to at least one of the first gate electrode and the second source/drain region, and has: (i) a first terminal end within a perimeter of the first unit cell footprint, and (ii) a second terminal end, which extends outside the perimeter of the first unit cell footprint but is not electrically connected to any current carrying region of any semiconductor device that is located outside the perimeter of the first unit cell footprint.