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公开(公告)号:US11600340B2
公开(公告)日:2023-03-07
申请号:US17462298
申请日:2021-08-31
Inventor: Seungwoo Seo , Byeongho Kim , Jaehyun Park , Jungho Ahn , Minbok Wi , Sunjung Lee , Eojin Lee , Wonkyung Jung , Jongwook Chung , Jaewan Choi
Abstract: A semiconductor memory device includes a plurality of memory banks including a first memory bank group including a computation circuit and a second memory bank group without a computation circuit; and a control circuit configured to control a PIM operation by the first memory bank group to be performed together with processing of memory requests for the plurality of memory banks while satisfying a maximum power consumption condition of the semiconductor memory device.
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公开(公告)号:US11568917B1
公开(公告)日:2023-01-31
申请号:US17504705
申请日:2021-10-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hoon Shin , Yeonhong Park , Jaewook Lee , Eojin Lee , Woosuk Kwon , Jungho Ahn , Taejun Ham
IPC: G11C11/4078
Abstract: A hammer refresh row address detector includes a control logic unit that receives a row address applied along with an active command, to increase a hit count stored in a corresponding entry when the row address is present in candidate aggressor row addresses stored in n entries. The control logic determines a candidate aggressor row address stored in an entry in which the hit count equals a threshold value to be a target aggressor row address. The control logic generates a victim row address adjacent to the target aggressor row address as a hammer refresh row address to accompany a hammer refresh command. The control logic increases the miss count value when the row address is not present in the candidate aggressor row addresses stored in the n entries and no hit count within the n entries is identical to the miss count value.
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公开(公告)号:US12225702B2
公开(公告)日:2025-02-11
申请号:US17957826
申请日:2022-09-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eojin Lee , Daeyoung Moon , Hoyoung Tang , Taehyung Kim
IPC: G11C11/412 , G11C8/16 , G11C11/419 , H10B10/00
Abstract: A dual-port static random access memory (SRAM) cell is provided. The dual-port SRAM cell includes: P-type active patterns that are spaced apart from one another along a first direction, each of the P-type active patterns extending in a second direction perpendicular to the first direction and including at least one transistor. The P-type active patterns include first through sixth P-type active patterns which are sequentially arranged along the first direction. A first cutting area is provided between the second P-type active pattern and a first boundary of the dual-port SRAM cell that extends along the first direction, and a second cutting area is provided between the fifth P-type active pattern and a second boundary that is opposite to the first boundary and extends along the first direction.
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公开(公告)号:US11436477B2
公开(公告)日:2022-09-06
申请号:US16857740
申请日:2020-04-24
Inventor: Yuhwan Ro , Byeongho Kim , Jaehyun Park , Jungho Ahn , Minbok Wi , Sunjung Lee , Eojin Lee , Wonkyung Jung , Jongwook Chung , Jaewan Choi
Abstract: A processor-implemented data processing method includes: generating compressed data of first matrix data based on information of a distance between valid elements included in the first matrix data; fetching second matrix data based on the compressed data; and generating output matrix data based on the compressed data and the second matrix data.
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公开(公告)号:US20240365528A1
公开(公告)日:2024-10-31
申请号:US18643224
申请日:2024-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changhoon SUNG , Hyojin Cho , Hoyoung Tang , Taehyung Kim , Eojin Lee
IPC: H10B10/00 , G11C5/06 , H01L23/528 , H01L27/092 , H01L29/06 , H01L29/423 , H01L29/775 , H01L29/78 , H01L29/786
CPC classification number: H10B10/125 , G11C5/063 , H01L23/5283 , H01L27/0924 , H01L29/0673 , H01L29/42392 , H01L29/775 , H01L29/7851 , H01L29/78696
Abstract: An integrated circuit is provided and includes a memory cell array, a plurality of gate electrodes extending in a first direction above a substrate, a plurality of word lines extending in the first direction above the substrate, a plurality of bit lines extending below the substrate in a second direction intersecting the first direction, and a plurality of first contacts passing through the substrate in a vertical direction and respectively connected to the plurality of bit lines.
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公开(公告)号:US11886985B2
公开(公告)日:2024-01-30
申请号:US17876136
申请日:2022-07-28
Inventor: Yuhwan Ro , Byeongho Kim , Jaehyun Park , Jungho Ahn , Minbok Wi , Sunjung Lee , Eojin Lee , Wonkyung Jung , Jongwook Chung , Jaewan Choi
CPC classification number: G06N3/063 , G06F9/3001 , G06F9/30145 , G06F9/3802 , G06F17/16 , G06N3/082 , G06N20/10
Abstract: A processor-implemented data processing method includes: generating compressed data of first matrix data based on information of a distance between valid elements included in the first matrix data; fetching second matrix data based on the compressed data; and generating output matrix data based on the compressed data and the second matrix data.
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公开(公告)号:US11139033B2
公开(公告)日:2021-10-05
申请号:US16833864
申请日:2020-03-30
Inventor: Seungwoo Seo , Byeongho Kim , Jaehyun Park , Jungho Ahn , Minbok Wi , Sunjung Lee , Eojin Lee , Wonkyung Jung , Jongwook Chung , Jaewan Choi
Abstract: A semiconductor memory device includes a plurality of memory banks including a first memory bank group including a computation circuit and a second memory bank group without a computation circuit; and a control circuit configured to control a PIM operation by the first memory bank group to be performed together with processing of memory requests for the plurality of memory banks while satisfying a maximum power consumption condition of the semiconductor memory device.
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