公开(公告)号：US09463479B2

公开(公告)日：2016-10-11

申请号：US13718706

申请日：2012-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong Park ,  Ho-moon Lee ,  Choo-ho Kim

IPC: B05B1/30

CPC classification number: B05B1/304 ,  B05B1/3046 ,  B05B15/18

Abstract: A phosphor dispenser includes: a nozzle having a space for accommodating the phosphor liquid, wherein an opening for ejecting the phosphor liquid is connected to the space; and a tappet reciprocally movable with respect to the nozzle to eject the phosphor liquid in the space through the nozzle, wherein the tappet includes a cylindrical unit having a cylindrical shape and a convex unit having a hemispherical shape that is convex towards the nozzle from the cylindrical unit, and the convex unit is formed of polycrystalline diamond (PCD).

Abstract translation: 荧光体分配器包括：具有用于容纳荧光体液体的空间的喷嘴，其中用于喷射荧光体液体的开口连接到该空间; 以及相对于所述喷嘴可往复移动的挺杆，以通过所述喷嘴将所述荧光体液体喷射到所述空间中，其中所述挺杆包括具有圆柱形状的圆柱形单元和具有半圆形形状的凸起单元，所述凸形单元从所述圆柱体朝向所述喷嘴凸起 单元，并且凸单元由多晶金刚石（PCD）形成。

公开(公告)号：US08860073B2

公开(公告)日：2014-10-14

申请号：US13709302

申请日：2012-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong Park ,  Choo-ho Kim ,  Won-ho Jung ,  Jin-ki Hong

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Abstract translation: 发光器件封装可以包括预模具和模制构件。 预模具可以包括具有倾斜（例如，凹入）平面的上体，通过该平面形成穿过上体的多个垂直孔，下体具有与倾斜（例如，凹）面相交的上表面 在上身下形成一个凹面单元。 成型构件可以填充多个垂直孔和凹形单元。

公开(公告)号：US09543221B2

公开(公告)日：2017-01-10

申请号：US14937347

申请日：2015-11-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae-seo Park ,  Ka-ram Lee ,  Choo-ho Kim

IPC: H01L21/20 ,  H01L21/66 ,  H01L33/58 ,  H01L33/54

CPC classification number: H01L22/12 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.

Abstract translation: 一种制造发光装置的方法包括：将基板设置在支撑体上; 在基板上设置包括发光器件的发光封装，以使发光封装件位于基板上的目标位置; 向发光封装施加能量，使发光元件发光; 并且分析由于能量而从发光装置发射的光，并且确定实际设置发光封装的位置。 因此，发光装置可以容易且廉价地制造，并且可以产生有限数量的斑点并提供改善的均匀亮度。

公开(公告)号：US08809189B2

公开(公告)日：2014-08-19

申请号：US13693795

申请日：2012-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eui-seok Kim ,  Sang-kyu Bang ,  Soo-hyun Cho ,  Choo-ho Kim ,  Won-soo Ji

IPC: H01L21/44

CPC classification number: H01L21/2633 ,  H01L21/76898 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract translation: 通过使用激光烧蚀形成穿硅通孔的方法。 一种方法包括：激光钻孔以通过将激光束照射到硅晶片的上表面上来形成多个凹槽，以及研磨硅晶片的下表面以形成多个穿硅通孔，以通过将 硅晶片的下表面。

公开(公告)号：US08791497B2

公开(公告)日：2014-07-29

申请号：US13677109

申请日：2012-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong Park ,  Dae-young Kim ,  Choo-ho Kim ,  Jomg-o Lim ,  Yong-rak Jeong

IPC: H01L33/52

CPC classification number: B29C45/14819 ,  B29C45/14655 ,  B29C45/2708 ,  B29C45/34 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package mold and a method of manufacturing a lens of a light-emitting device package. The light-emitting device package mold includes a convex unit, an inner circumference of which has a hemispherical shape; a flat panel unit that forms a flat panel by extending from an edge of the convex unit; a cylindrical unit extending in a vertical direction with respect to an upper surface of the flat panel unit; and an injection hole and a discharge hole that penetrate through the convex unit, wherein the discharge hole is formed in a horizontal direction with respect to the flat panel unit.

Abstract translation: 发光器件封装模具和制造发光器件封装的透镜的方法。 发光装置封装模具包括：其内周具有半球形状的凸部; 平板组件，其通过从所述凸单元的边缘延伸而形成平板; 圆筒形单元，其相对于所述平板单元的上表面在垂直方向上延伸; 以及贯通凸部的注入孔和排出孔，其中，排出孔相对于平板单元在水平方向上形成。

公开(公告)号：US20140017837A1

公开(公告)日：2014-01-16

申请号：US13844742

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eui-seok KIM ,  Choo-ho Kim ,  Soo-Hyun Cho ,  Won-soo Ji

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2924/12036 ,  H01L2924/1204 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods of cutting silicon substrates having a light-emitting element package. The method includes preparing a silicon substrate on which a plurality of light-emitting element chips are mounted and a transparent material layer that covers the light-emitting element chips is formed; removing the transparent material layer between the light-emitting element chips along a predetermined cutting line by using a mechanical cutting method; forming a scribing line corresponding to the predetermined cutting line on the silicon substrate by using a laser processing method; and cutting the silicon substrate to form individual light-emitting element packages by applying a mechanical impact to the silicon substrate along the scribing line. The method may enhance productivity of a cutting process of light-emitting element packages, and may prevent damage or transformation of the transparent material layer.

Abstract translation: 切割具有发光元件封装的硅衬底的方法。 该方法包括制备其上安装有多个发光元件芯片的硅基板，并且形成覆盖发光元件芯片的透明材料层; 通过使用机械切割方法沿着预定切割线去除所述发光元件芯片之间的透明材料层; 通过使用激光加工方法在所述硅基板上形成与所述预定切割线对应的划线; 以及通过沿着所述划刻线对所述硅衬底施加机械冲击来切割所述硅衬底以形成单独的发光元件封装。 该方法可以提高发光元件封装的切割加工的生产率，并且可以防止透明材料层的损坏或变形。