公开(公告)号：US08860073B2

公开(公告)日：2014-10-14

申请号：US13709302

申请日：2012-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun-yong Park ,  Choo-ho Kim ,  Won-ho Jung ,  Jin-ki Hong

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Abstract translation: 发光器件封装可以包括预模具和模制构件。 预模具可以包括具有倾斜（例如，凹入）平面的上体，通过该平面形成穿过上体的多个垂直孔，下体具有与倾斜（例如，凹）面相交的上表面 在上身下形成一个凹面单元。 成型构件可以填充多个垂直孔和凹形单元。