公开(公告)号：US20140017837A1

公开(公告)日：2014-01-16

申请号：US13844742

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eui-seok KIM ,  Choo-ho Kim ,  Soo-Hyun Cho ,  Won-soo Ji

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2924/12036 ,  H01L2924/1204 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods of cutting silicon substrates having a light-emitting element package. The method includes preparing a silicon substrate on which a plurality of light-emitting element chips are mounted and a transparent material layer that covers the light-emitting element chips is formed; removing the transparent material layer between the light-emitting element chips along a predetermined cutting line by using a mechanical cutting method; forming a scribing line corresponding to the predetermined cutting line on the silicon substrate by using a laser processing method; and cutting the silicon substrate to form individual light-emitting element packages by applying a mechanical impact to the silicon substrate along the scribing line. The method may enhance productivity of a cutting process of light-emitting element packages, and may prevent damage or transformation of the transparent material layer.

Abstract translation: 切割具有发光元件封装的硅衬底的方法。 该方法包括制备其上安装有多个发光元件芯片的硅基板，并且形成覆盖发光元件芯片的透明材料层; 通过使用机械切割方法沿着预定切割线去除所述发光元件芯片之间的透明材料层; 通过使用激光加工方法在所述硅基板上形成与所述预定切割线对应的划线; 以及通过沿着所述划刻线对所述硅衬底施加机械冲击来切割所述硅衬底以形成单独的发光元件封装。 该方法可以提高发光元件封装的切割加工的生产率，并且可以防止透明材料层的损坏或变形。