公开(公告)号：US09543221B2

公开(公告)日：2017-01-10

申请号：US14937347

申请日：2015-11-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae-seo Park ,  Ka-ram Lee ,  Choo-ho Kim

IPC: H01L21/20 ,  H01L21/66 ,  H01L33/58 ,  H01L33/54

CPC classification number: H01L22/12 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.

Abstract translation: 一种制造发光装置的方法包括：将基板设置在支撑体上; 在基板上设置包括发光器件的发光封装，以使发光封装件位于基板上的目标位置; 向发光封装施加能量，使发光元件发光; 并且分析由于能量而从发光装置发射的光，并且确定实际设置发光封装的位置。 因此，发光装置可以容易且廉价地制造，并且可以产生有限数量的斑点并提供改善的均匀亮度。