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公开(公告)号：US20170263522A1
公开(公告)日：2017-09-14
申请号：US15264684
申请日：2016-09-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Thomas A. KIM , Kyu Bum HAN , Chang Moo JUNG , Kyung In KANG , Sang Kyu LEE
IPC: H01L23/31 , H01L23/00 , H01L21/56 , H01L23/367
CPC classification number: H01L23/3171 , H01L21/56 , H01L21/568 , H01L23/13 , H01L23/3128 , H01L23/367 , H01L23/5389 , H01L24/03 , H01L24/09 , H01L24/19 , H01L24/33 , H01L24/46 , H01L24/49 , H01L24/73 , H01L2224/0231 , H01L2224/0237 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/1434 , H01L2924/1816
Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.
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公开(公告)号：US20190163945A1
公开(公告)日：2019-05-30
申请号：US15966621
申请日：2018-04-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Ho KIM , Eun Sil KIM , Sang Kyu LEE , Jong Man KIM , Seok Hwan KIM
Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
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公开(公告)号：US20190131232A1
公开(公告)日：2019-05-02
申请号：US16037670
申请日：2018-07-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyu LEE , Jeong Ho LEE
IPC: H01L23/498 , H01L23/31 , H01L25/065 , H01L25/16 , H01L23/00
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/20 , H01L25/0655 , H01L25/16 , H01L2224/0231 , H01L2224/02375 , H01L2224/02377 , H01L2224/16227 , H01L2224/16238 , H01L2224/18 , H05K1/185 , H01L2924/0001
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a first recess portion and a first stopper layer disposed on a bottom surface of the first recess portion; a semiconductor chip disposed in the first recess portion and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the first stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the first recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other.
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Patent Agency Ranking
公开(公告)号：US20170287825A1
公开(公告)日：2017-10-05
申请号：US15352060
申请日：2016-11-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Koon LEE , Sang Kyu LEE , Yong Jin SEOL
IPC: H01L23/498 , H01L23/29 , H01L23/31 , H01L21/56 , H01L23/00 , H01L23/367 , H01L21/48 , H01L23/552 , H01L23/538
CPC classification number: H01L23/49827 , H01L21/56 , H01L23/16 , H01L23/29 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/5384 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L2224/02379 , H01L2224/04105 , H01L2224/05569 , H01L2224/05572 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/24011 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025
Abstract: A fan-out semiconductor package include a frame having a through hole; a semiconductor chip disposed in the through hole, and having an active surface, an inactive surface, and a side surface; an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the frame and the semiconductor chip in the through hole, a first conductive layer disposed on a sidewall of the through hole, a second conductive layer disposed on one side of the frame, and connected to the first conductive layer, a line via passing through the encapsulant, and connected to the second conductive layer, and a third conductive layer covering at least the inactive surface of the semiconductor chip on the encapsulant, and connected to the line via.
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公开(公告)号：US20170287839A1
公开(公告)日：2017-10-05
申请号：US15353249
申请日：2016-11-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Koon LEE , Yong Jin SEOL , Sang Kyu LEE
IPC: H01L23/538 , H01L21/768 , H01L23/00 , H01L23/31 , H01L21/56
CPC classification number: H01L23/5389 , H01L21/56 , H01L21/76802 , H01L21/76877 , H01L21/76895 , H01L23/13 , H01L23/145 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/2101 , H01L2224/214
Abstract: A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously and connected to the first wiring, and a second wiring disposed on the second insulating layer and connected to the line via; a semiconductor chip disposed on one side of the redistribution layer, and having an electrode pad electrically connected to the first wiring, the second wiring, and the line via; and an encapsulant disposed on the one side of the redistribution layer, and encapsulating the semiconductor chip.
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公开(公告)号：US20170373030A1
公开(公告)日：2017-12-28
申请号：US15489117
申请日：2017-04-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyu LEE , Jin Gu KIM
CPC classification number: H01L24/06 , H01L23/3128 , H01L23/49827 , H01L24/05 , H01L24/13 , H01L24/24 , H01L24/25 , H01L2224/02331 , H01L2224/0235 , H01L2224/02373 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/05008 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/06182 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/16238 , H01L2224/18 , H01L2224/20 , H01L2224/221 , H01L2224/24155 , H01L2224/244 , H01L2224/25171 , H01L2224/25175 , H01L2924/15153 , H01L2924/19105
Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip; and connection terminals disposed on the second interconnection member. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip, and a connection pad and a connection terminal are electrically connected to each other by a pathway passing through the redistribution layer of the first interconnection member.
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公开(公告)号：US20140285921A1
公开(公告)日：2014-09-25
申请号：US13948729
申请日：2013-07-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyu LEE , Jin Seok Jang , Hong Joo Lee
Abstract: There is provided a spindle motor including: a stator core fixedly installed on a stator; a driving magnet having a center thereof disposed to coincide with that of the stator core in an axial direction; and a rotor hub including a hub body having a disk shape, a magnet mounting part extended from an edge of the hub body in a downward axial direction and having the driving magnet installed on an inner peripheral surface thereof, and a disk supporting part extended from the magnet mounting part in a radial direction, wherein the stator includes a base member, and a pulling magnet is installed on at least one of a lower surface of the disk supporting part and an upper surface of the base member disposed to face the lower surface of the disk supporting part.
Abstract translation: 提供了一种主轴电动机，其包括：固定地安装在定子上的定子铁心; 驱动磁体，其中心沿轴向设置成与定子芯的中心一致; 以及转子轮毂，其包括具有圆盘形状的轮毂体，从所述轮毂体的边缘向下轴向延伸并且具有安装在其内周面上的驱动磁体的磁体安装部，以及从所述轮毂主体的内周面延伸的盘支撑部 所述磁体安装部分沿径向方向，其中所述定子包括基部构件，并且拉动磁体安装在所述盘支撑部分的下表面和所述基部构件的上表面中的至少一个上，所述上表面设置成面向所述下表面 的盘支撑部。
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公开(公告)号：US20140035429A1
公开(公告)日：2014-02-06
申请号：US14051438
申请日：2013-10-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyung Seob SHIN , Sang Kyu LEE
IPC: H02K1/14
CPC classification number: H02K1/146 , G11B19/2009 , H02K21/222
Abstract: Disclosed is a stator core including a core back fixedly inserted onto an outer surface of a stationary member, a plurality of teeth protruding from the core back in an outer diameter direction, wherein a coil is wound around the plurality of teeth so as to allow magnetic flux from a magnet to flow to the teeth, front end portions defining outer edges of the teeth, respectively, and body portions defining a length of the teeth and having a width increasing from the core back toward the front end portions, respectively.
Abstract translation: 公开了一种定子铁心，其包括固定地插入到固定构件的外表面上的铁芯背部，在外径方向上从所述铁芯背部突出的多个齿，其中线圈围绕所述多个齿缠绕以允许磁 来自磁体的磁通分别流到齿，分别限定齿的外边缘的前端部分和限定齿的长度并且具有从芯部朝向前端部分的宽度增加的主体部分。
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