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公开(公告)号：US20190198429A1
公开(公告)日：2019-06-27
申请号：US16012037
申请日：2018-06-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Young Gwan KO , Jeong Ho LEE , Shang Hoon SEO , Yong Jin SEOL
IPC: H01L23/495 , H01L23/552 , H01L23/34
CPC classification number: H01L23/4952 , H01L23/34 , H01L23/49541 , H01L23/49575 , H01L23/552
Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is disposed on the stopper layer; first metal bumps disposed on the connection pads; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first metal bumps and filling at least portions of the recess portion; a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other; and a first blocking structure disposed on walls of the recess portion to surround side surfaces of the semiconductor chip.
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公开(公告)号：US20170287839A1
公开(公告)日：2017-10-05
申请号：US15353249
申请日：2016-11-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Koon LEE , Yong Jin SEOL , Sang Kyu LEE
IPC: H01L23/538 , H01L21/768 , H01L23/00 , H01L23/31 , H01L21/56
CPC classification number: H01L23/5389 , H01L21/56 , H01L21/76802 , H01L21/76877 , H01L21/76895 , H01L23/13 , H01L23/145 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/2101 , H01L2224/214
Abstract: A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously and connected to the first wiring, and a second wiring disposed on the second insulating layer and connected to the line via; a semiconductor chip disposed on one side of the redistribution layer, and having an electrode pad electrically connected to the first wiring, the second wiring, and the line via; and an encapsulant disposed on the one side of the redistribution layer, and encapsulating the semiconductor chip.
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3.发明申请公开(公告)号：US20140062811A1
公开(公告)日：2014-03-06
申请号：US13842501
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Jin SEOL
IPC: H01Q1/46
CPC classification number: H01Q1/46
Abstract: There are provided a cable having an antenna embedded therein, and an input apparatus having the same, and a computer apparatus. The cable includes: a cable body having a predetermined length and an internal space; one or more power lines disposed in the internal space of the cable body and connected between both ends of the cable body; an antenna disposed in the internal space of the cable body, and transmitting and receiving a wireless signal; and a separating part disposed in the internal space of the cable body and electrically connected between the one or more power lines and the antenna to separate a power signal transmitted through the one or more power lines and the wireless signal transmitted and received through the antenna.
Abstract translation: 提供了具有嵌入其中的天线的电缆，以及具有该天线的输入设备和计算机设备。 电缆包括：具有预定长度和内部空间的电缆体; 一根或多根电力线设置在电缆主体的内部空间中并连接在电缆体的两端之间; 设置在所述电缆体的内部空间中的天线，以及发送和接收无线信号; 以及分离部，其设置在电缆主体的内部空间中，并且电连接在一个或多个电力线和天线之间，以分离通过一个或多个电力线发送的电力信号和通过天线发送和接收的无线信号。
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Patent Agency Ranking
公开(公告)号：US20170373035A1
公开(公告)日：2017-12-28
申请号：US15478374
申请日：2017-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Jin SEOL , Yong Koon LEE
CPC classification number: H01L24/25 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/24 , H01L25/105 , H01L25/18 , H01L2224/02373 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/06131 , H01L2224/06135 , H01L2224/06139 , H01L2224/06177 , H01L2224/06182 , H01L2224/13024 , H01L2224/14131 , H01L2224/14135 , H01L2224/14181 , H01L2224/16227 , H01L2224/24105 , H01L2224/24226 , H01L2224/25171 , H01L2224/2518 , H01L2924/19102
Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the wiring substrate.
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公开(公告)号：US20180158791A1
公开(公告)日：2018-06-07
申请号：US15870593
申请日：2018-01-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Jin SEOL , Yong Koon LEE
CPC classification number: H01L24/25 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/24 , H01L25/105 , H01L25/18 , H01L2224/02373 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/06131 , H01L2224/06135 , H01L2224/06139 , H01L2224/06177 , H01L2224/06182 , H01L2224/13024 , H01L2224/14131 , H01L2224/14135 , H01L2224/14181 , H01L2224/16227 , H01L2224/24105 , H01L2224/24226 , H01L2224/25171 , H01L2224/2518 , H01L2924/19102
Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the wiring substrate.
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公开(公告)号：US20180061801A1
公开(公告)日：2018-03-01
申请号：US15789685
申请日：2017-10-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Jin SEOL , Yong Koon LEE
CPC classification number: H01L24/25 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/24 , H01L25/105 , H01L25/18 , H01L2224/02373 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/06131 , H01L2224/06135 , H01L2224/06139 , H01L2224/06177 , H01L2224/06182 , H01L2224/13024 , H01L2224/14131 , H01L2224/14135 , H01L2224/14181 , H01L2224/16227 , H01L2224/24105 , H01L2224/24226 , H01L2224/25171 , H01L2224/2518 , H01L2924/19102
Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the wiring substrate.
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公开(公告)号：US20170373029A1
公开(公告)日：2017-12-28
申请号：US15471205
申请日：2017-03-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Jin SEOL , Chang Bae LEE , Min Seok JANG
CPC classification number: H01L23/481 , H01L23/3107 , H01L24/05 , H01L24/13 , H01L24/24 , H01L24/25 , H01L29/0657 , H01L2224/0233 , H01L2224/0235 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0401 , H01L2224/04105 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/06135 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/16238 , H01L2224/18 , H01L2224/20 , H01L2224/221 , H01L2224/24155 , H01L2224/244 , H01L2224/25171 , H01L2224/25175 , H01L2924/10156 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15153
Abstract: A fan-out semiconductor package includes a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposite the active surface; an encapsulant encapsulating at least some portions of the first interconnection member and the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the semiconductor chip. The first interconnection member and the second interconnection member respectively include a plurality of redistribution layers electrically connected to the connection pads of the semiconductor chip, and the semiconductor chip has a groove defined in the active surface and between a peripheral edge of the semiconductor chip and the connection pads of the semiconductor chip.
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公开(公告)号：US20170287825A1
公开(公告)日：2017-10-05
申请号：US15352060
申请日：2016-11-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Koon LEE , Sang Kyu LEE , Yong Jin SEOL
IPC: H01L23/498 , H01L23/29 , H01L23/31 , H01L21/56 , H01L23/00 , H01L23/367 , H01L21/48 , H01L23/552 , H01L23/538
CPC classification number: H01L23/49827 , H01L21/56 , H01L23/16 , H01L23/29 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/5384 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L2224/02379 , H01L2224/04105 , H01L2224/05569 , H01L2224/05572 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/24011 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025
Abstract: A fan-out semiconductor package include a frame having a through hole; a semiconductor chip disposed in the through hole, and having an active surface, an inactive surface, and a side surface; an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the frame and the semiconductor chip in the through hole, a first conductive layer disposed on a sidewall of the through hole, a second conductive layer disposed on one side of the frame, and connected to the first conductive layer, a line via passing through the encapsulant, and connected to the second conductive layer, and a third conductive layer covering at least the inactive surface of the semiconductor chip on the encapsulant, and connected to the line via.
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