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公开(公告)号：US20240332208A1
公开(公告)日：2024-10-03
申请号：US18226994
申请日：2023-07-27
发明人： Chi Hyeon JEONG , Hyun Sang KWAK , Seong Hwan LEE
IPC分类号： H01L23/552 , H01L23/13 , H01L23/498 , H01L23/538
CPC分类号： H01L23/552 , H01L23/13 , H01L23/49822 , H01L23/5385 , H01L24/13 , H01L24/16 , H01L25/0655 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/16227 , H01L2924/014
摘要： A printed circuit board includes a substrate portion including a first insulating layer, a first wiring layer disposed on or within the first insulating layer, and a cavity penetrating through at least a portion of the first insulating layer; a connection structure disposed within the cavity of the substrate portion, and including a second insulating layer, a second wiring layer disposed on or within the second insulating layer, and a metal layer disposed on a lower surface and a side surface of the second insulating layer, wherein the metal layer is disposed on an outermost side of the connection structure.
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公开(公告)号：US20230343519A1
公开(公告)日：2023-10-26
申请号：US17875988
申请日：2022-07-28
摘要： A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.
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公开(公告)号：US20230199291A1
公开(公告)日：2023-06-22
申请号：US17752262
申请日：2022-05-24
发明人： Se Yeon HWANG , Hyun Sang KWAK , Yeo Ok JEON , Joon Woo GI , Seok Hwan KIM
CPC分类号： H04N5/2253 , H04N5/2257 , H05K1/181 , H05K2201/10151 , H05K2201/05
摘要： A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.
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公开(公告)号：US20240332199A1
公开(公告)日：2024-10-03
申请号：US18226988
申请日：2023-07-27
IPC分类号： H01L23/538 , H01L21/48
CPC分类号： H01L23/5385 , H01L21/4846 , H01L23/5386 , H01L24/13 , H01L24/16 , H01L25/0655 , H01L2224/13111 , H01L2224/13124 , H01L2224/13147 , H01L2224/16227 , H01L2924/014
摘要： A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.
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公开(公告)号：US20230307179A1
公开(公告)日：2023-09-28
申请号：US17851542
申请日：2022-06-28
发明人： Min Cheol PARK , Sang Jong LEE , Hyung Joon KIM , Hyun Sang KWAK , Chi Hyeon JEONG , Seong Hwan LEE
CPC分类号： H01G4/005 , H01G4/30 , H01G4/228 , H01G4/1227 , H05K1/182 , H05K2201/10015
摘要： A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.
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