公开(公告)号：US20180215894A1

公开(公告)日：2018-08-02

申请号：US15746985

申请日：2016-07-29

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan CHENG ,  Yun ZHENG ,  Huihui LI ,  Haowei TANG ,  Chao LIU ,  Richard LIU

IPC: C08K3/22 ,  C08K3/013 ,  C08K5/00 ,  C08K7/14 ,  C08K7/06 ,  C08L69/00

CPC classification number: C08K3/22 ,  C08K3/013 ,  C08K5/0041 ,  C08K5/18 ,  C08K5/315 ,  C08K5/3447 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2248 ,  C08K2003/2293 ,  C08K2003/2296 ,  C08L23/0869 ,  C08L33/04 ,  C08L51/04 ,  C08L69/00 ,  C08L69/005 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/0275 ,  H05K2201/09118 ,  C08L101/00

Abstract: The disclosure concerns polymer compositions exhibiting LDS properties while maintaining mechanical properties and a dark color throughout the composition.

公开(公告)号：US20200262998A1

公开(公告)日：2020-08-20

申请号：US16477036

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yaqin ZHANG ,  Jian WANG ,  Mingcheng GUO ,  Yunan CHENG ,  Shijie SONG

IPC: C08K3/04 ,  C08K7/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C23C18/16

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20180230294A1

公开(公告)日：2018-08-16

申请号：US15752929

申请日：2016-08-24

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan CHENG ,  Shijie SONG

IPC: C08K5/5313 ,  C08K7/14 ,  C08K3/22 ,  C08K7/00 ,  C08K3/08 ,  B29C45/00 ,  B29C35/08 ,  B29B7/90

CPC classification number: C08K5/5313 ,  B29B7/90 ,  B29C35/0805 ,  B29C45/0001 ,  B29C45/0005 ,  B29C2035/0838 ,  B29K2077/00 ,  B29K2105/0005 ,  B29K2105/16 ,  B29K2309/08 ,  B29K2479/085 ,  B29K2505/02 ,  C08K3/08 ,  C08K3/22 ,  C08K5/49 ,  C08K7/00 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2201/003 ,  C08K2201/005 ,  C23C18/1641 ,  C23C18/38 ,  C08L77/06

Abstract: Disclosed herein are laser activatable compositions. One composition may comprise: about 35% to about 75% by weight of at least one polyamide resin, preferably a 9,T resin; about 0.1% to about 20% by weight of a laser direct structuring additive; the laser activatable additive being operative to plate the composition upon being activated by a laser; about 0.5% to 20% by weight of a phosphorus-containing additive, preferably an organo phosphinate salt; and about 10% to 50% by weight of a reinforcing fiber, preferably a glass fiber having a substantially circular cross-section, the substantially circular cross-section having a diameter of 10 microns or less; where all weight percents are based on the total weight of the composition. Further embodiments provide compositions further comprising one or more organic, metallic, or mineral fillers, pigments, or combinations thereof. Also disclosed are methods of preparing these compositions and articles produced therefrom.

公开(公告)号：US20200022264A1

公开(公告)日：2020-01-16

申请号：US16490130

申请日：2018-03-02

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Liang SHEN

IPC: H05K3/18 ,  B29C35/08 ,  B29C48/08 ,  B29C48/00 ,  B29C65/02 ,  C23C18/16 ,  C23C18/20

Abstract: A process of forming an article utilizes an ultra-thin, removable, catalytic film for Laser Direct Structuring (LDS). The process includes forming a film from a laser-activatable material, the film exhibiting thickness of less than 100 μm; applying the film to a black or opaque substrate to form a film-substrate element; applying a laser to the film-substrate element; removing a portion of the film from the film-substrate element; and applying metal plating to a portion of the black or opaque substrate. Removal of the film from the film-substrate element may follow metal plating of the black or opaque substrate. An article formed by the process may be useful in a computer device, electromagnetic interference device, printed circuit, Wi-Fi device, Bluetooth device, GPS device, cellular antenna device, smart phone device, automotive device, medical device, sensor device, RF antenna device, LED device, RFID device, or a component of a cell phone antenna.

公开(公告)号：US20190352503A1

公开(公告)日：2019-11-21

申请号：US16476757

申请日：2018-01-10

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Shijie SONG ,  Jian WANG

IPC: C08L71/12 ,  C08L23/10 ,  B29C35/08 ,  C23C18/20 ,  B29C45/00 ,  C23C18/16

Abstract: Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.

公开(公告)号：US20190322861A1

公开(公告)日：2019-10-24

申请号：US16095887

申请日：2017-04-27

Applicant: SABIC Global Technologies B.V.

Inventor： Zhenke WEI ,  Tong WU ,  Yunan CHENG ,  Qin WANG

IPC: C08L67/02 ,  C08K7/14 ,  C08K3/32 ,  C08K3/22 ,  C08L69/00 ,  C08L77/00

Abstract: A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.