公开(公告)号：US20190352501A1

公开(公告)日：2019-11-21

申请号：US16477230

申请日：2017-04-21

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Qin WANG ,  Shijie SONG

IPC: C08L69/00 ,  C08K3/32

Abstract: Disclosed herein are methods and thermoplastic compositions of blended polycarbonate thermoplastic compositions with improved heat resistance. The resulting blended polymer thermoplastic compositions, comprising at least one aromatic polycarbonate; at least one high heat PPPBP-polycarbonate copolymer; at least one polycarbonate-siloxane copolymer; and at least one copper salt based laser direct structuring additive; wherein the composition is capable of being plated after being activated using a laser; and wherein the composition has a heat distortion temperature higher than 150° C., as determined by ASTM D 648.

公开(公告)号：US20190322861A1

公开(公告)日：2019-10-24

申请号：US16095887

申请日：2017-04-27

Applicant: SABIC Global Technologies B.V.

Inventor： Zhenke WEI ,  Tong WU ,  Yunan CHENG ,  Qin WANG

IPC: C08L67/02 ,  C08K7/14 ,  C08K3/32 ,  C08K3/22 ,  C08L69/00 ,  C08L77/00

Abstract: A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.

公开(公告)号：US20200377718A1

公开(公告)日：2020-12-03

申请号：US16772240

申请日：2018-12-12

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mingcheng GUO ,  Qin WANG ,  Shen ZHANG

IPC: C08L67/02 ,  C08K7/14 ,  C08K3/40 ,  C08K7/06

Abstract: A composition includes about 20 wt % to about 80 wt % of a first resin consisting of polybutylene terephthalate (PBT); about 1 wt % to about 20 wt % of a second resin that is different from the first resin, wherein the second resin does not include polyethylene terephthalate (PET); from about 0.5 wt % to about 10 wt % of a first processing aid; and from about 10 wt % to about 60 wt % of a reinforcing filler. The composition has a tensile modulus of at least 3,000 MPa and a notched Izod impact strength of at least 50 J/m. Methods of making the composition are also described.

公开(公告)号：US20190177519A1

公开(公告)日：2019-06-13

申请号：US16300991

申请日：2017-05-25

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Zhenke WEI ,  Qin WANG ,  Mian DAI

IPC: C08L23/12 ,  C08L71/12 ,  C08L69/00 ,  C08K7/14 ,  C08L67/02 ,  C08L23/08 ,  C08L25/08

Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.