公开(公告)号：US20210130585A1

公开(公告)日：2021-05-06

申请号：US16476690

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Yunan Cheng ,  Yaqin ZHANG ,  Shijie SONG

IPC: C08K9/12

Abstract: Disclosed herein are compositions thermoplastic composition comprising: (a) about 20 wt % to about 99 wt % of a polymer component; and (b) about 1 wt % to about 30 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component comprising copper hydroxide phosphate or tin and antimony oxide, said core comprising from about 10 wt % to about 80 wt % of the laser activatable additive and said shell comprising from about 20 wt % to about 90 wt % of the laser activatable additive.

公开(公告)号：US20210024701A1

公开(公告)日：2021-01-28

申请号：US16982630

申请日：2019-03-18

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08G77/00 ,  C08G77/46 ,  C08L71/12 ,  C08L83/12 ,  C08K3/013 ,  C08K5/00 ,  C08K3/22 ,  C08K3/30

Abstract: A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.

公开(公告)号：US20190352503A1

公开(公告)日：2019-11-21

申请号：US16476757

申请日：2018-01-10

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Shijie SONG ,  Jian WANG

IPC: C08L71/12 ,  C08L23/10 ,  B29C35/08 ,  C23C18/20 ,  B29C45/00 ,  C23C18/16

Abstract: Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.

公开(公告)号：US20190352501A1

公开(公告)日：2019-11-21

申请号：US16477230

申请日：2017-04-21

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Qin WANG ,  Shijie SONG

IPC: C08L69/00 ,  C08K3/32

Abstract: Disclosed herein are methods and thermoplastic compositions of blended polycarbonate thermoplastic compositions with improved heat resistance. The resulting blended polymer thermoplastic compositions, comprising at least one aromatic polycarbonate; at least one high heat PPPBP-polycarbonate copolymer; at least one polycarbonate-siloxane copolymer; and at least one copper salt based laser direct structuring additive; wherein the composition is capable of being plated after being activated using a laser; and wherein the composition has a heat distortion temperature higher than 150° C., as determined by ASTM D 648.

公开(公告)号：US20180258282A1

公开(公告)日：2018-09-13

申请号：US15752908

申请日：2016-07-21

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08L71/12 ,  C08L53/02 ,  C08L25/06 ,  C08K3/22 ,  C08K3/30 ,  C08K3/014 ,  B29C47/00

CPC classification number: C08L71/12 ,  B29C48/022 ,  C08K3/014 ,  C08K3/20 ,  C08K3/22 ,  C08K3/30 ,  C08K2003/2241 ,  C08L25/06 ,  C08L53/02 ,  C08L2203/20

Abstract: Disclosed are resin compositions that include poly(arylene ether), HIPS/GPPS), impact modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low level. The compositions also possess excellent mechanical and processing performance, for example, superior high impact strength and good ductility, compared to prior art compositions. The compositions can be used to form components of wireless electronic communications devices in order to ensure a low degree of signal attenuation.

公开(公告)号：US20200262998A1

公开(公告)日：2020-08-20

申请号：US16477036

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yaqin ZHANG ,  Jian WANG ,  Mingcheng GUO ,  Yunan CHENG ,  Shijie SONG

IPC: C08K3/04 ,  C08K7/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C23C18/16

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20190309205A1

公开(公告)日：2019-10-10

申请号：US16308185

申请日：2017-06-06

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mingcheng GUO ,  Yaqin ZHANG ,  Shijie SONG ,  Narong AN ,  Yubin BAO

IPC: C09K5/14 ,  C08L69/00 ,  B29C45/00 ,  B29C48/00

Abstract: Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

公开(公告)号：US20180230294A1

公开(公告)日：2018-08-16

申请号：US15752929

申请日：2016-08-24

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan CHENG ,  Shijie SONG

IPC: C08K5/5313 ,  C08K7/14 ,  C08K3/22 ,  C08K7/00 ,  C08K3/08 ,  B29C45/00 ,  B29C35/08 ,  B29B7/90

CPC classification number: C08K5/5313 ,  B29B7/90 ,  B29C35/0805 ,  B29C45/0001 ,  B29C45/0005 ,  B29C2035/0838 ,  B29K2077/00 ,  B29K2105/0005 ,  B29K2105/16 ,  B29K2309/08 ,  B29K2479/085 ,  B29K2505/02 ,  C08K3/08 ,  C08K3/22 ,  C08K5/49 ,  C08K7/00 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2201/003 ,  C08K2201/005 ,  C23C18/1641 ,  C23C18/38 ,  C08L77/06

Abstract: Disclosed herein are laser activatable compositions. One composition may comprise: about 35% to about 75% by weight of at least one polyamide resin, preferably a 9,T resin; about 0.1% to about 20% by weight of a laser direct structuring additive; the laser activatable additive being operative to plate the composition upon being activated by a laser; about 0.5% to 20% by weight of a phosphorus-containing additive, preferably an organo phosphinate salt; and about 10% to 50% by weight of a reinforcing fiber, preferably a glass fiber having a substantially circular cross-section, the substantially circular cross-section having a diameter of 10 microns or less; where all weight percents are based on the total weight of the composition. Further embodiments provide compositions further comprising one or more organic, metallic, or mineral fillers, pigments, or combinations thereof. Also disclosed are methods of preparing these compositions and articles produced therefrom.

公开(公告)号：US20210009886A1

公开(公告)日：2021-01-14

申请号：US17040733

申请日：2019-03-26

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Yaqin ZHANG

IPC: C09K5/14 ,  C08L71/12 ,  C08J3/20 ,  H05K1/03 ,  H05K1/02

Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US20200010658A1

公开(公告)日：2020-01-09

申请号：US16458556

申请日：2019-07-01

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08L23/14

Abstract: A thermoplastic composition includes: from 48.9 wt % to 93.9 wt % of a thermoplastic resin component including polypropylene, polypropylene copolymer, blends thereof or combinations thereof; from 5 wt % to 50 wt % glass fiber; from 1 wt % to 30 wt % impact modifier; and from 0.1 wt % to 10 wt % of a polyolefin-siloxane copolymer. The thermoplastic composition has a dielectric constant (Dk) of less than 2.8 at from 1-5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 at from 1-5 GHz, the combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition. Articles including the thermoplastic composition—and in particular telecommunications devices including the thermoplastic composition—are also described.