公开(公告)号：US20180065392A1

公开(公告)日：2018-03-08

申请号：US15551808

申请日：2016-02-19

Applicant: SABIC Global Technologies B.V.

Inventor： Tong WU ,  Mingcheng GUO ,  Jiwen WANG ,  Xiaofeng YU

IPC: B41M5/26 ,  C08L77/02 ,  C08L77/06 ,  C08L79/08 ,  C08K3/22 ,  C08K3/32 ,  C08K9/06

CPC classification number: B41M5/267 ,  C08K3/013 ,  C08K3/22 ,  C08K3/32 ,  C08K9/06 ,  C08K2003/2241 ,  C08K2003/2248 ,  C08K2003/321 ,  C08K2003/328 ,  C08L77/02 ,  C08L77/06 ,  C08L79/08 ,  C08L101/00

Abstract: The disclosure concerns polymer compositions exhibiting thermal conductivity and laser marking properties while maintaining mechanical properties and a light color throughout the composition.

公开(公告)号：US20180355170A1

公开(公告)日：2018-12-13

申请号：US15580501

申请日：2016-06-27

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Mingcheng GUO ,  Haowei TANG ,  Shan QIN ,  Shengying QIAN

IPC: C08L77/00 ,  C08L69/00 ,  C08L71/02 ,  C08L65/02 ,  C08L23/16 ,  C08L23/08 ,  C08K5/09 ,  C08K5/17 ,  C08K5/42 ,  C08K5/1515 ,  C08K3/22 ,  C08K3/38

CPC classification number: C08L77/00 ,  C08K3/22 ,  C08K3/38 ,  C08K5/09 ,  C08K5/1515 ,  C08K5/17 ,  C08K5/42 ,  C08K2003/2224 ,  C08K2003/385 ,  C08K2201/001 ,  C08L23/0815 ,  C08L23/16 ,  C08L51/06 ,  C08L65/02 ,  C08L69/00 ,  C08L71/02 ,  C08L77/02

Abstract: The present disclosure is directed to polymer composites, and, particularly, thermally conductive polymer composites. The polymer composites can include from about 20 wt. % to about 80 wt. % of a base polymer resin; from about 1 wt. % to about 70 wt. % of thermoconductive filler material comprising thermoconductive particles having a plurality of electronegative functional groups at the surface of the particles, and having a thermal conductivity of at least 2 W/m*K; from about 0.01 wt. % to about 20 wt. % of an amphiphilic compatibilizer including a hydrophilic component and hydrophobic chain component; and, optionally, from about 0 wt. % to 50 wt. % of an additive. As compared to a control composition having 0.00 wt. % of the amphiphilic compatibilizer, the composite has (i) increased mechanical strength as measured by Izod impact testing, and, (ii) increased thermal conductivity as measured by through-plane or in-plane testing.

公开(公告)号：US20180237598A1

公开(公告)日：2018-08-23

申请号：US15752013

申请日：2016-08-08

Applicant: SABIC Global Technologies B.V.

Inventor： Mingcheng GUO ,  Feng GONG ,  Shen ZHANG

IPC: C08J3/22 ,  C08J5/04 ,  C08J5/08 ,  C08K7/14 ,  C08K3/04 ,  C08L77/02 ,  C08L77/06 ,  C08L51/06 ,  C08K5/00

CPC classification number: C08J3/226 ,  C08J5/043 ,  C08J5/08 ,  C08J2377/02 ,  C08J2377/04 ,  C08J2377/06 ,  C08J2377/08 ,  C08J2423/04 ,  C08J2423/26 ,  C08K3/04 ,  C08K5/0041 ,  C08K7/14 ,  C08L23/06 ,  C08L51/06 ,  C08L77/02 ,  C08L77/06 ,  C08L83/04

Abstract: The disclosure concerns glass fiber filled nylon resin composites including a polyolefin based color masterbatch. The compositions further comprise a compatibilizer.

公开(公告)号：US20200377718A1

公开(公告)日：2020-12-03

申请号：US16772240

申请日：2018-12-12

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mingcheng GUO ,  Qin WANG ,  Shen ZHANG

IPC: C08L67/02 ,  C08K7/14 ,  C08K3/40 ,  C08K7/06

Abstract: A composition includes about 20 wt % to about 80 wt % of a first resin consisting of polybutylene terephthalate (PBT); about 1 wt % to about 20 wt % of a second resin that is different from the first resin, wherein the second resin does not include polyethylene terephthalate (PET); from about 0.5 wt % to about 10 wt % of a first processing aid; and from about 10 wt % to about 60 wt % of a reinforcing filler. The composition has a tensile modulus of at least 3,000 MPa and a notched Izod impact strength of at least 50 J/m. Methods of making the composition are also described.

公开(公告)号：US20170183475A1

公开(公告)日：2017-06-29

申请号：US15320454

申请日：2015-06-26

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Mingcheng GUO ,  Yun ZHENG

IPC: C08K3/00 ,  C09K21/02 ,  C08K3/22 ,  C09K5/14

CPC classification number: C08K3/016 ,  C08K3/22 ,  C08K3/32 ,  C08K3/34 ,  C08K3/38 ,  C08K5/5435 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/329 ,  C08K2003/387 ,  C08K2201/001 ,  C09K5/14 ,  C09K21/02 ,  C08L77/02

Abstract: The invention concerns compositions comprising (a) from about 20 wt % to about 80 wt % of a polymer component; (b) from about 10 wt % to about 70 wt % of a flame retardant component; and (c) from about 0.01 wt % to about 5 wt % of an acid component; wherein the combined weight percent value of all components does not exceed 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein the composition has: (i) a thermal conductivity of at least about 1.5 W/mK for through plane thermal conductivity; (ii) flame retardancy of at least VI at 0.8 mm using the UL94 test standard; and (iii) melt volume flow rate of at least 10 g/cm3 using ASTM D 1238.

公开(公告)号：US20200262998A1

公开(公告)日：2020-08-20

申请号：US16477036

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yaqin ZHANG ,  Jian WANG ,  Mingcheng GUO ,  Yunan CHENG ,  Shijie SONG

IPC: C08K3/04 ,  C08K7/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C23C18/16

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20190309205A1

公开(公告)日：2019-10-10

申请号：US16308185

申请日：2017-06-06

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mingcheng GUO ,  Yaqin ZHANG ,  Shijie SONG ,  Narong AN ,  Yubin BAO

IPC: C09K5/14 ,  C08L69/00 ,  B29C45/00 ,  B29C48/00

Abstract: Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

公开(公告)号：US20180312650A1

公开(公告)日：2018-11-01

申请号：US15770986

申请日：2016-10-17

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Ming GU ,  Feng JIANG ,  Mingcheng GUO

IPC: C08J7/04 ,  C09D5/24 ,  C09D5/32

CPC classification number: C08J7/04 ,  C08J2375/04 ,  C09D5/24 ,  C09D5/32

Abstract: An article may comprise a substrate formed from a thermoplastic or thermoset; and a thermal conductive or heat absorptive coating disposed adjacent the substrate to form a composite stack, wherein the composite stack is characterized by an increase of through plane thermal conductivity of at least 2 W/m*K, when compared to the substrate without the coating.