IMPROVED DIELECTRIC STRENGTH COMPOSITIONS
    1.
    发明申请

    公开(公告)号:US20180291204A1

    公开(公告)日:2018-10-11

    申请号:US15573937

    申请日:2016-05-10

    IPC分类号: C08L79/08 B29C45/00

    摘要: A molded article having improved dielectric strength is disclosed. The molded article is formed by (a) providing a thermoplastic resin composition including a base polymer resin and a mold release agent; and (b) molding the thermoplastic resin composition to form the molded article. The dielectric strength of the molded article formed is higher than a comparator molded article comprising the thermoplastic resin composition in the absence of the mold release agent.