摘要:
A polycarbonate composition includes: a continuous polycarbonate phase; discontinuous first domains distributed in the continuous phase, and comprising a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and a (meth)acrylate copolymer shell, wherein the first domains have an aspect ratio of at least 1.7, preferably at least 1.8; and discontinuous second domains distributed in the continuous phase, and comprising an alkenyl aromatic-olefin block copolymer impact modifier, wherein the second domains have an aspect ratio of at least 3, preferably at least 4, and a domain size of 6400 square nanometers or less, more preferably 5700 square nanometers or less. Optionally, the polycarbonate composition includes: a polycarbonate; a brominated polycarbonate different from the polycarbonate; a poly(carbonate-siloxane) comprising 30 to 70 weight percent of siloxane blocks; a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and an (meth)acrylate copolymer shell; and an alkenyl aromatic-olefin block copolymer impact modifier.
摘要:
A copolycarbonate optical article comprises a polycarbonate composition including: a copolycarbonate having: 2 to 60 mol % of phthalimidine carbonate units, 2 to 90 mol % of high heat carbonate units, and optionally 2 to 60 mol % of bisphenol A carbonate units. The copolycarbonate has less than 100 ppm of each of phthalimidine, high heat bisphenol, and bisphenol A monomers, and less than 5 ppm of various ions, and is prepared from monomers each having a purity of at least 99.6%. The polycarbonate composition has a glass transition temperature of 200° C. to and a yellowness index of less than 30.
摘要:
A copolycarbonate optical article comprises a polycarbonate composition including: a copolycarbonate having: 2 to 60 mol % of phthalimidine carbonate units, 2 to 90 mol % of high heat carbonate units, and optionally 2 to 60 mol % of bisphenol A carbonate units. The copolycarbonate has less than 100 ppm of each of phthalimidine, high heat bisphenol, and bisphenol A monomers, and less than 5 ppm of various ions, and is prepared from monomers each having a purity of at least 99.6%. The polycarbonate composition has a glass transition temperature of 200° C. to and a yellowness index of less than 30.
摘要:
A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.
摘要:
The present disclosure relates to a thermoplastic composition having a better mold release performance. The disclosed thermoplastic composition comprises polycarbonate components, an impact modifier and a mold release composition. Also disclosed is a method for making the disclosed thermoplastic composition and an article of manufacture comprising the disclosed polymer composition.
摘要:
A cover assembly for an electronic device includes a glass layer having a first surface and a second surface opposite the first surface, a first having a first surface and a second surface opposite the first surface, and an optically clear polymer film disposed on the optically clear adhesive on a side opposite the glass layer, the polymer film comprising a thermoplastic polymer. The cover assembly transmits greater than 85% of visible light as determined according to ASTM D1003-00. A method of manufacturing the cover assembly is also described. The cover assembly can be useful for use with an electronic device.
摘要:
A copolycarbonate includes 0.005-0.1 mole percent of sulfur-containing carbonate units derived from a sulfur-containing bisphenol monomer, 2-95 mole percent of high heat carbonate units derived from a high heat aromatic dihydroxy monomer, and 5-98 mole percent of a low heat carbonate units derived from a low heat aromatic monomer, each based on the sum of the moles of the carbonate units; and optionally, thioether carbonyl endcaps of the formula —C(═O)-L-S—R, wherein L is a C1-12 aliphatic or aromatic linking group and R is a C1-20 alkyl, C6-18 aryl, or C7-24 arylalkylene; wherein the sulfur content of the high heat copolycarbonate in the absence of the thioether endcaps is from 5-20 parts per million by weight.
摘要:
A polycarbonate composition includes: a continuous polycarbonate phase; discontinuous first domains distributed in the continuous phase, and comprising a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and a (meth)acrylate copolymer shell, wherein the first domains have an aspect ratio of at least 1.7, preferably at least 1.8; and discontinuous second domains distributed in the continuous phase, and comprising an alkenyl aromatic-olefin block copolymer impact modifier, wherein the second domains have an aspect ratio of at least 3, preferably at least 4, and a domain size of 6400 square nanometers or less, more preferably 5700 square nanometers or less. Optionally, the polycarbonate composition includes: a polycarbonate; a brominated polycarbonate different from the polycarbonate; a poly(carbonate-siloxane) comprising 30 to 70 weight percent of siloxane blocks; a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and an (meth)acrylate copolymer shell; and an alkenyl aromatic-olefin block copolymer impact modifier.
摘要:
A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C., and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.
摘要:
A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.