专利检索 ap:("SABIC Global Technologies B.V.") AND inv:"Timothy Michael Allessio" 第 1 页

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发明申请
COVER ASSEMBLY FOR AN ELECTRONIC DEVICE, METHOD OF MANUFACTURE, AND DEVICE COMPRISING THE COVER ASSEMBLY 审中-公开

公开(公告)号：US20190039352A1

公开(公告)日：2019-02-07

申请号：US16073554

申请日：2017-01-27

申请人： SABIC Global Technologies B.V.

发明人： Wei Zhao , Michael M. Laurin , Xiaoyu Sun , Jong-Min Choi , Timothy Michael Allessio

IPC分类号： B32B17/06 , B32B7/12

摘要： A cover assembly for an electronic device includes a glass layer having a first surface and a second surface opposite the first surface, a first having a first surface and a second surface opposite the first surface, and an optically clear polymer film disposed on the optically clear adhesive on a side opposite the glass layer, the polymer film comprising a thermoplastic polymer. The cover assembly transmits greater than 85% of visible light as determined according to ASTM D1003-00. A method of manufacturing the cover assembly is also described. The cover assembly can be useful for use with an electronic device.