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    Processing technology for LCM samples
    3.
    发明授权
    Processing technology for LCM samples 有权
    LCM样品的加工技术

    公开(公告)号：US06528248B2

    公开(公告)日：2003-03-04

    申请号：US09562495

    申请日：2000-05-01

    Applicant: Ann Bennett Lossing ,  Sherrie L. Ransom ,  Steven T. Kunitake ,  Robert H. Reamey ,  David F. Head ,  Hala Al-Shawany

    Inventor： Ann Bennett Lossing ,  Sherrie L. Ransom ,  Steven T. Kunitake ,  Robert H. Reamey ,  David F. Head ,  Hala Al-Shawany

    IPC: A01G506

    CPC classification number: G01N1/2813 ,  G01N2001/284

    Abstract: Systems and methods are described for barriers on laser capture microdissection samples. A method of processing a biological sample for laser capture microdissection, includes: providing the biological sample; and applying a substance to the biological sample so as to provide a barrier between the biological sample and a surrounding environment. The systems and methods provide advantages because non-specific pick-up is reduced, visualization is improved, sample degradation is reduced, and contamination is reduced.

    Abstract translation: 描述了用于激光捕获显微解剖样品的障碍的系统和方法。 一种处理用于激光捕获显微切割的生物样品的方法，包括：提供生物样品; 以及将物质施加到所述生物样品以便在所述生物样品和周围环境之间提供屏障。 这些系统和方法提供了优点，因为非特异性吸收降低，可视化得到改善，样品降解降低，污染减少。

    Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
    4.
    发明授权
    Highly thermally conductive yet highly comformable alumina filled composition and method of making the same 失效
    高导热但高度可变形的氧化铝填充组合物及其制备方法

    公开(公告)号：US5929138A

    公开(公告)日：1999-07-27

    申请号：US746024

    申请日：1996-11-05

    Applicant: Frank W. Mercer ,  David P. Ching ,  Zbigniew Cichocki ,  Robert H. Reamey

    Inventor： Frank W. Mercer ,  David P. Ching ,  Zbigniew Cichocki ,  Robert H. Reamey

    IPC: C08L101/00 ,  C08K3/22 ,  C08L53/00 ,  C08L53/02 ,  C08L83/04 ,  C09J153/02 ,  C09K5/00 ,  C08K7/16 ,  C08K3/10 ,  C08K3/18

    CPC classification number: C09J153/025 ,  C08K3/22 ,  C08L53/00 ,  C08L53/025

    Abstract: A highly thermally conductive but yet highly conformable composition is made from gel filled with alumina. The use of .alpha.-alumina in which at least 10 weight % of the .alpha.-alumina particles have a particle size of at least 74 .mu.m makes possible the high filler levels needed to attain high thermal conductivity, without causing the decrease in elongation and softness normally associated with high filler levels. Further improvements are observed if the .alpha.-alumina and the gel (or precursor thereof) are mixed with a specific energy input of at least 10 Joule/g. The input of such specific energy has the effect making the resulting composition more conformable than it otherwise would be. The composition may be internally supported by a flexible matrix such as a fabric or open-celled foam.

    Abstract translation: 高度导热但高度贴合的组合物由填充有氧化铝的凝胶制成。 使用其中至少10重量％的α-氧化铝颗粒具有至少74μm的粒度的α-氧化铝使得获得高热导率所需的高填料水平成为可能，而不会导致伸长率和柔软度的降低 通常与高填料水平相关。 如果将α-氧化铝和凝胶（或其前体）与至少10焦耳/克的比能量输入混合，则观察到进一步的改进。 这种比能量的输入具有使得所得到的组合物比其它方式更适应的效果。 组合物可以由柔性基质如织物或开孔泡沫内部支撑。

    Stabilization of poly(arylene ether ketones)
    5.
    发明授权
    Stabilization of poly(arylene ether ketones) 失效
    聚（亚芳基醚酮）的稳定化

    公开(公告)号：US4874839A

    公开(公告)日：1989-10-17

    申请号：US229082

    申请日：1988-08-05

    Applicant: Wayne Montoya ,  Robert H. Reamey

    Inventor： Wayne Montoya ,  Robert H. Reamey

    IPC: C08G67/00 ,  C08F6/00 ,  C08G61/12 ,  C08G65/46

    CPC classification number: C08F6/00 ,  C08G61/127 ,  C08G65/46

    Abstract: A method of stabilizing a poly(arylene ether ketone), which method comprises in one embodiment heating the poly(arylene ether ketone) at a temperature between about 240.degree. C. and about 325.degree. C. for a period of between about 0.5 and about 24 hours, prior to any melt-processing of the poly(arylene ether ketone) and in another embodiment hydrothermally treating the poly(arylene ether ketone) by heating it to a temperature of at least 160.degree. C. while contacting it with water.

    Abstract translation: 一种稳定聚（亚芳基醚酮）的方法，该方法包括在一个实施方案中，在约240℃至约325℃的温度下加热聚（亚芳基醚酮）约0.5至约 24小时之前，在聚（亚芳基醚酮）的任何熔融加工之前，在另一个实施方案中，通过将聚（亚芳基醚酮）加热至160℃以上，同时将其与水接触来水热处理。

    Preparation of poly(arylene ether ketones)
    6.
    发明授权
    Preparation of poly(arylene ether ketones) 失效
    聚（亚芳基醚酮）的制备

    公开(公告)号：US4698393A

    公开(公告)日：1987-10-06

    申请号：US922781

    申请日：1986-10-23

    Applicant: Viktors Jansons ,  Heinrich C. Gors ,  Stephen Moore ,  Robert H. Reamey ,  Paul Becker

    Inventor： Viktors Jansons ,  Heinrich C. Gors ,  Stephen Moore ,  Robert H. Reamey ,  Paul Becker

    IPC: C08F4/00 ,  C08G61/12 ,  C08G67/00 ,  C08L65/00 ,  C08F293/00

    CPC classification number: C08G67/00 ,  C08G61/127 ,  C08L65/00

    Abstract: The preparation of poly(arylene ether ketones) by Friedel-Crafts polymerization, in the presence of a Lewis acid catalyst and a diluent, is conducted under conditions in which the polymer and/or its complex with the catalyst is suspended in the diluent during at least part of the polyreaction mixture if desired. The dispersant may be a polymer or an organic compound containing at least eight carbon atoms and is preferably a Lewis base. The dispersant preferably contains at least one molecular segment substantially compatible with the poly(arylene ether ketone) or its complex with the Lewis acid and substantially incompatible with the diluent and at least one molecular segment substantially compatible with the diluent and substantially incompatible with the poly(arylene ether ketone) or its complex with the Lewis acid.

    Abstract translation: 在路易斯酸催化剂和稀释剂存在下，通过Friedel-Crafts聚合法制备聚（亚芳基醚酮）是在聚合物和/或其与催化剂的络合物悬浮在稀释剂中的条件下进行的 如果需要，最少部分的聚反应混合物。 分散剂可以是聚合物或含有至少8个碳原子的有机化合物，优选为路易斯碱。 分散剂优选含有至少一个基本上与聚（亚芳基醚酮）或其与路易斯酸的络合物相容的分子片段，并且与稀释剂基本上不相容，并且至少一个分子片段基本上与稀释剂相容并且与聚（ 亚芳基醚酮）或其与路易斯酸的络合物。

    Dissipation of heat from a circuit board having bare silicon chips mounted thereon
    7.
    发明授权
    Dissipation of heat from a circuit board having bare silicon chips mounted thereon 有权
    从安装有裸硅片的电路板散热

    公开(公告)号：US06531771B1

    公开(公告)日：2003-03-11

    申请号：US09890602

    申请日：2001-11-06

    Applicant: Paul G. Schoenstein ,  Benjamin L. Sitler ,  Robert H. Reamey ,  Christine E. Vogdes

    Inventor： Paul G. Schoenstein ,  Benjamin L. Sitler ,  Robert H. Reamey ,  Christine E. Vogdes

    IPC: H01L2334

    CPC classification number: H01L23/36 ,  H01L23/3737 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-°C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

    Abstract translation: 公开了一种制造用于电路板的散热装置的方法，其上安装有具有暴露面的裸硅芯片。 散热器具有平面部分，其内表面（面向电路板）被施加一个或多个凝胶组合物的焊盘。 当散热器附接到电路板并且完全覆盖芯片的暴露面时，焊盘与裸芯片相对定位。 凝胶组合物具有大于其粘合强度的内聚强度，具有小于1.38MPa的压缩模量，并且具有大于1.0W / m-℃的热导率，并且厚度在约0.08mm至约1.0之间 mm。 凝胶材料的低压缩模量保护芯片免受机械应力的传递。

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