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    PACKAGE COMPRISING DUMMY INTERCONNECTS
    1.
    发明申请
    PACKAGE COMPRISING DUMMY INTERCONNECTS 有权

    公开(公告)号：US20210280507A1

    公开(公告)日：2021-09-09

    申请号：US16810589

    申请日：2020-03-05

    Applicant: QUALCOMM Incorporated

    Inventor： Manuel ALDRETE ,  Milind SHAH ,  Srikanth KULKARNI

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/64 ,  H01L21/56 ,  H01L21/48

    Abstract: A package comprising a substrate comprising a first surface and a second surface, a passive device coupled to the first surface of the substrate, a first encapsulation layer located over the first surface of the substrate, wherein the first encapsulation layer encapsulates the passive device, an integrated device coupled to the second surface of the substrate, a second encapsulation layer located over the second surface of the substrate, wherein the second encapsulation layer encapsulates the integrated device, a plurality of through encapsulation layer interconnects coupled to the substrate, a plurality of encapsulation layer interconnects coupled to the plurality of through encapsulation layer interconnects, and at least one dummy interconnect located in the second encapsulation layer, wherein the at least one dummy interconnect is located vertically over a back side of the integrated device.

    AIR CAVITY MOLD
    3.
    发明申请
    AIR CAVITY MOLD 审中-公开

    公开(公告)号：US20190067141A1

    公开(公告)日：2019-02-28

    申请号：US15691696

    申请日：2017-08-30

    Applicant: QUALCOMM Incorporated

    Inventor： Jie FU ,  Hong Bok WE ,  Manuel ALDRETE

    IPC: H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/027 ,  H01L21/683

    Abstract: Conventional packages for 5G applications suffer from disadvantages including high mold stress on the die, reduced performance, and increased keep-out zone. To address these and other issues of the conventional packages, it is proposed to pre-apply a wafer-applied material, which remains in place, to form an air cavity between the die and the substrate. The air cavity can enhance the die's performance. Also, since the wafer-applied material can remain in place, the keep-out zone can be reduced. As a result, higher density modules can be fabricated.

    INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
    4.
    发明申请
    INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING 有权

    公开(公告)号：US20250125244A1

    公开(公告)日：2025-04-17

    申请号：US18605481

    申请日：2024-03-14

    Applicant: QUALCOMM Incorporated

    Inventor： Manuel ALDRETE ,  Rajneesh KUMAR ,  Zhijie WANG ,  Aniket PATIL ,  Srikanth KULKARNI

    IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

    Abstract: In an aspect, an integrated circuit (IC) package includes a base structure, an IC component disposed on the base structure, a plurality of interposer connection structures disposed on the base structure, and an interposer structure disposed over the IC component and the plurality of interposer connection structures. The plurality of interposer connection structures is configured to connect the base structure and the interposer structure. Each interposer connection structure of the plurality of interposer connection structures includes a bond ball portion that is connected to the interposer structure, and a bond wire portion that is coupled to the bond ball portion and extends toward the base structure. A width of the bond ball portion is greater than a width of the bond wire portion.

    SEGMENTED THERMAL AND RF GROUND
    6.
    发明申请
    SEGMENTED THERMAL AND RF GROUND 审中-公开

    公开(公告)号：US20190006999A1

    公开(公告)日：2019-01-03

    申请号：US15636626

    申请日：2017-06-28

    Applicant: QUALCOMM Incorporated

    Inventor： Daeik Daniel KIM ,  Manuel ALDRETE ,  Bonhoon KOO

    IPC: H03F1/30

    CPC classification number: H03F1/30 ,  H01L23/66 ,  H01L2223/6677 ,  H03F2200/186 ,  H04B2001/0408

    Abstract: An exemplary improved ground for a power amplifier circuit may include structural separation of the drive amplifier and the power amplifier grounds and cut-off of the power amplifier induced feedback current to ensure stability under a wide-range of operating conditions. The exemplary power amplifier may include a first ground coupled to a first amplifier circuit, a second ground coupled to a second amplifier circuit separate from the first ground, and the first amplifier circuit generates a drive current for the second amplifier circuit.

    PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
    9.
    发明申请
    PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE 有权

    公开(公告)号：US20250070086A1

    公开(公告)日：2025-02-27

    申请号：US18455928

    申请日：2023-08-25

    Applicant: QUALCOMM Incorporated

    Inventor： Aniket PATIL ,  Joan Rey Villarba BUOT ,  Michelle Yejin KIM ,  Manuel ALDRETE

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

    Abstract: A device includes a bottom substrate including first conductors, a top substrate including second conductors, and a first die disposed between the bottom substrate and the top substrate. The first die includes circuitry and first contacts electrically connected to the circuitry and to the first conductors. The device also includes a redistribution die disposed between the bottom substrate and the top substrate adjacent to the first die. The redistribution die includes second contacts electrically connected to the first contacts through the first conductors and third contacts electrically connected to the second conductors. The redistribution die also includes redistribution traces electrically connected to the second contacts and to the third contacts. The top substrate includes fourth contacts electrically connected through the second conductors to the third contacts to define one or more signal paths between the fourth contacts and the first die.

    MIXED PAD SIZE AND PAD DESIGN
    10.
    发明申请
    MIXED PAD SIZE AND PAD DESIGN 有权

    公开(公告)号：US20220157705A1

    公开(公告)日：2022-05-19

    申请号：US17097327

    申请日：2020-11-13

    Applicant: QUALCOMM Incorporated

    Inventor： Wen YIN ,  Yonghao AN ,  Manuel ALDRETE

    IPC: H01L23/498 ,  H01L21/48

    Abstract: Disclosed is a package and method of forming the package with a mixed pad size. The package includes a first set of pads having a first size and a first pitch, where the first set of pads are solder mask defined (SMD) pads. The package also includes a second set of pads having a second size and a second pitch, where the second set of pads are non-solder mask defined (NSMD) pads.

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