公开(公告)号：US20250096051A1

公开(公告)日：2025-03-20

申请号：US18471069

申请日：2023-09-20

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun YEON ,  Kun FANG ,  Suhyung HWANG ,  Sang-Jae LEE ,  Rajneesh KUMAR ,  Manuel ALDRETE ,  Zhijie WANG ,  Seongho KIM

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L25/16

Abstract: A package comprising a first substrate; a first integrated device coupled to the first substrate through at least a first plurality of solder interconnects; a second substrate coupled to the first substrate through at least a second plurality of solder interconnects, wherein the second substrate includes a cavity; and an encapsulation layer located at least between the first substrate and the second substrate, wherein the encapsulation layer is coupled to the first substrate, the second substrate and the first integrated device.

公开(公告)号：US20250046688A1

公开(公告)日：2025-02-06

申请号：US18363557

申请日：2023-08-01

Applicant: QUALCOMM Incorporated

Inventor： Zhijie WANG ,  Rajneesh KUMAR ,  Manuel ALDRETE ,  Sang-Jae LEE ,  Seongho KIM

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H10B80/00

Abstract: An integrated device includes a die including active circuitry and a first set of contacts; a first substrate including a second set of contacts and a third set of contacts on a first side of the first substrate and a fourth set of contacts on a second side of the first substrate; a mold compound disposed on the first side of the first substrate and at least partially encapsulating the die; and a set of through mold conductors coupled to the third set of contacts and extending through the mold compound, wherein an upper surface of the mold compound, an upper surface of the die, and an upper surface of each of the set of through mold conductors are coplanar.