公开(公告)号：US20180033537A1

公开(公告)日：2018-02-01

申请号：US15288967

申请日：2016-10-07

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H03H7/46 ,  H01F41/04 ,  H01F27/28 ,  H03H7/01

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F41/041 ,  H01F2017/004 ,  H01F2017/0086 ,  H01L23/49822 ,  H01L23/5227 ,  H01L28/10 ,  H03H7/0138 ,  H03H7/463 ,  H03H2001/0078

Abstract: A stepped-width, co-spiral inductor structure includes a first exterior layer having a first exterior width. The stepped-width, co-spiral inductor structure also includes a first interior layer coupled to the first exterior layer. The first interior layer includes a first interior width that is wider than the first exterior width of the first exterior layer. The stepped-width, co-spiral inductor structure further includes a second exterior layer coupled to the first interior layer. The second exterior layer includes a second exterior width that is narrower than the first interior width of the first interior layer.

公开(公告)号：US20180316319A1

公开(公告)日：2018-11-01

申请号：US15584000

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Shu ZHANG ,  Bonhoon KOO ,  Manuel ALDRETE ,  Jie FU ,  Chin-Kwan KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H03F1/52 ,  H03F3/189 ,  H03F3/20 ,  H03F1/56 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/12

CPC classification number: H01L23/12 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/16237 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49175

Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.

公开(公告)号：US20180315540A1

公开(公告)日：2018-11-01

申请号：US15857478

申请日：2017-12-28

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H01F27/28 ,  H05K1/02 ,  H05K1/11 ,  H01F27/29 ,  H01F41/04

Abstract: A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.

公开(公告)号：US20180228016A1

公开(公告)日：2018-08-09

申请号：US15429144

申请日：2017-02-09

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Jie FU ,  Manuel ALDRETE ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11 ,  H05K13/00 ,  H05K3/40

CPC classification number: H05K1/023 ,  H01L23/552 ,  H01L24/49 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/115 ,  H05K3/30 ,  H05K3/4038 ,  H05K9/0024 ,  H05K13/00 ,  H05K2201/0715 ,  H01L2224/45099

Abstract: In a package such as a radio frequency (RF) module, an external shield may be provided to shield the package from external influences as well as to shield the devices within the package from undesirable affecting devices outside of the package. The package may also include an internal shield to suppress adverse effects of the signal generated by an aggressor device within the external shield to other devices within the external shield.