公开(公告)号：US20140124877A1

公开(公告)日：2014-05-08

申请号：US13764261

申请日：2013-02-11

Applicant: QUALCOMM INCORPORATED

Inventor： Yangyang Sun ,  Lily Zhao ,  Michael Han

IPC: H01L29/43 ,  H01L29/84 ,  H01L21/768 ,  H01L23/498

CPC classification number: H01L29/43 ,  B81B2207/093 ,  B81C1/00269 ,  B81C2203/019 ,  H01L21/768 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L29/84 ,  H01L2224/02166 ,  H01L2224/03019 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/11019 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/1183 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13138 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13163 ,  H01L2224/13565 ,  H01L2224/13687 ,  H01L2224/13688 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/01034 ,  H01L2924/0109 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A conductive interconnect includes an inorganic collar. The conductive interconnect includes a conductive support layer. The conductive interconnect also includes a conductive material on the conductive support layer. The conductive interconnect further includes an inorganic collar partially surrounding the conductive material. The inorganic collar is also disposed on sidewalls of the conductive support layer.

Abstract translation: 导电互连包括无机套环。 导电互连包括导电支撑层。 导电互连件还包括在导电支撑层上的导电材料。 导电互连还包括部分地围绕导电材料的无机套管。 无机套环也设置在导电支撑层的侧壁上。

公开(公告)号：US20140008788A1

公开(公告)日：2014-01-09

申请号：US13777271

申请日：2013-02-26

Applicant: QUALCOMM INCORPORATED

Inventor： Zhongping Bao ,  Lily Zhao ,  Michael Han

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06133 ,  H01L2224/06141 ,  H01L2224/06145 ,  H01L2224/06517 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/14145 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/2064

Abstract: Some exemplary embodiments of this disclosure pertain to a semiconductor package that includes a packaging substrate, a die and a set of under bump metallization (UBM) structures coupled to the packaging substrate and the die. Each UBM structure has a non-circular cross-section along its respective lateral dimension. Each UBM structure includes a first narrower portion and a second wider portion. The first narrower portion has a first width. The second wider portion has a second width that is greater than the first width. Each UBM structure is oriented towards a particular region of the die such that the first narrower portion of the UBM structure is closer than the second wider portion of the UBM structure to the particular region of the die.

Abstract translation: 本公开的一些示例性实施例涉及包括封装衬底，管芯和耦合到封装衬底和管芯的一组凹凸金属化（UBM）结构的半导体封装。 每个UBM结构沿其相应的横向尺寸具有非圆形横截面。 每个UBM结构包括第一较窄部分和第二较宽部分。 第一较窄部分具有第一宽度。 第二较宽部分具有大于第一宽度的第二宽度。 每个UBM结构朝向模具的特定区域，使得UBM结构的第一较窄部分比UBM结构的第二较宽部分更靠近模具的特定区域。