Semiconductor device
    3.
    发明授权

    公开(公告)号:US10090220B2

    公开(公告)日:2018-10-02

    申请号:US15427629

    申请日:2017-02-08

    Abstract: A semiconductor device includes a substrate; a semiconductor layer; a first protective film; a first adhesive layer disposed on the first protective film; an electrode pad disposed on the first protective film; a second protective film disposed to cover and be in contact with the electrode pad and the first adhesive layer; and a first opening formed in part of the second protective film such that the upper surface of the electrode pad is exposed, wherein in a plan view, the first adhesive layer includes a first projection projecting from the electrode pad radially in a direction of the periphery of the electrode pad and continuously surrounding the periphery of the electrode pad; and the second protective film is continuously to cover and contact part of the upper and side surfaces of the electrode pad, the upper and side surfaces of first projection, and the first protective film.

    Semiconductor device
    5.
    发明授权

    公开(公告)号:US10475802B2

    公开(公告)日:2019-11-12

    申请号:US15812525

    申请日:2017-11-14

    Abstract: A semiconductor device includes: a substrate; a first nitride semiconductor layer and a second nitride semiconductor layer having a band gap wider than a band gap of the first nitride semiconductor layer; a first active region which includes a source electrode, a drain electrode, and a gate electrode, and has a first carrier layer located in the first nitride semiconductor layer; and a second active region which is on an extension of a long-side direction of the drain electrode and has a second carrier layer located in the first nitride semiconductor layer via an element isolation region, and a potential of the second carrier layer is substantially same as a potential of a source extraction electrode in the second active region or is an intermediate potential between a potential of a gate extraction electrode and the potential of the source extraction electrode opposite a short side of the drain electrode.

    Nitride semiconductor device
    6.
    发明授权
    Nitride semiconductor device 有权
    氮化物半导体器件

    公开(公告)号:US09502549B2

    公开(公告)日:2016-11-22

    申请号:US14887249

    申请日:2015-10-19

    Abstract: A nitride semiconductor device includes the followings. A semiconductor multilayer structure is above a substrate and includes a first nitride semiconductor layer and a second nitride semiconductor layer. A source electrode, a drain electrode, and a gate electrode are on the semiconductor multilayer structure. A gate wiring line transmits a gate driving signal to gate electrodes. A first shield structure is on the semiconductor multilayer structure between the drain electrode and the gate electrode or between the drain electrode and the gate wiring line in a non-channel region where an actual current path from the drain electrode to the source electrode is not formed in the semiconductor multilayer structure. The first shield structure is a normally-off structure, suppresses a current flowing from the semiconductor multilayer structure, and is set to have a substantially same potential as a potential of the source electrode.

    Abstract translation: 氮化物半导体器件包括以下。 半导体多层结构在衬底之上,并且包括第一氮化物半导体层和第二氮化物半导体层。 源电极,漏电极和栅电极在半导体多层结构上。 栅极布线将栅极驱动信号传输到栅电极。 第一屏蔽结构在漏极电极和栅电极之间的半导体层叠结构上,或者在不形成从漏电极到源电极的实际电流路径的非沟道区域中的漏电极和栅极布线之间 在半导体多层结构中。 第一屏蔽结构是常关结构,抑制从半导体多层结构流过的电流,并且被设定为具有与源电极的电位大致相同的电位。

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