公开(公告)号：US09578734B2

公开(公告)日：2017-02-21

申请号：US14355141

申请日：2013-09-19

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/02 ,  C08J5/24 ,  B32B15/14 ,  H05K1/03 ,  C08G59/62 ,  C08L63/00

CPC classification number: H05K1/0271 ,  B32B15/14 ,  C08G59/621 ,  C08J5/24 ,  C08J2333/02 ,  C08J2363/00 ,  C08J2433/02 ,  C08L63/00 ,  C08L2205/02 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.

Abstract translation: 本公开内容涉及通过加热干燥浸渍有树脂组合物的织物基材形成的预浸料，直到树脂组合物处于半固化状态。 树脂组合物含有（A）具有萘骨架的环氧树脂和酚类固化剂中的至少一种; 和（B）具有由下式（I）和（II）表示的结构的聚合物，碳原子之间的不饱和键，环氧值为0.2至0.8 ep / kg，重均分子量为20万 至850,000：其中X：Y = 0：1至0.35：0.65，R1表示H或CH3，R2表示H或烷基。

公开(公告)号：US09516746B2

公开(公告)日：2016-12-06

申请号：US14359909

申请日：2012-11-21

Applicant: PANASONIC CORPORATION

Inventor： Koji Kishino ,  Hiroharu Inoue ,  Takeshi Kitamura

IPC: H05K1/03 ,  H05K1/02 ,  B32B5/02 ,  B32B15/08 ,  B32B15/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B17/04 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K1/0298 ,  B32B5/022 ,  B32B15/08 ,  B32B15/14 ,  B32B17/04 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/54 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0195 ,  H05K2201/029 ,  Y10T428/2495

Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Abstract translation: 本发明的覆金属层压板包括设置在绝缘层的至少一个表面上的绝缘层和金属层。 绝缘层通过层叠至少中心层和设置在中心层的两个表面上的表面树脂层而形成。 中心层含有热固性树脂，并且包括含有至少一种纤维基材的芯层和不含纤维基材的热固性树脂层。 表面树脂层的厚度与热固性树脂层的厚度的比率为0.5〜10。

公开(公告)号：US20140311781A1

公开(公告)日：2014-10-23

申请号：US14359909

申请日：2012-11-21

Applicant: PANASONIC CORPORATION

Inventor： Koji Kishino ,  Hiroharu Inoue ,  Takeshi Kitamura

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  B32B5/022 ,  B32B15/08 ,  B32B15/14 ,  B32B17/04 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/54 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0195 ,  H05K2201/029 ,  Y10T428/2495

Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Abstract translation: 本发明的覆金属层压板包括设置在绝缘层的至少一个表面上的绝缘层和金属层。 绝缘层通过层叠至少中心层和设置在中心层的两个表面上的表面树脂层而形成。 中心层含有热固性树脂，并且包括含有至少一种纤维基材的芯层和不含纤维基材的热固性树脂层。 表面树脂层的厚度与热固性树脂层的厚度的比率为0.5〜10。

公开(公告)号：US20140116764A1

公开(公告)日：2014-05-01

申请号：US14126837

申请日：2012-06-12

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/03

CPC classification number: H05K1/036 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B2250/40 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/269

Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.

Abstract translation: 根据本发明的覆金属层压板设置有绝缘层和存在于绝缘层的至少一个表面侧上的金属层。 绝缘层是通过层叠至少两层而形成的，所述层是设置在第一树脂层和金属层之间的第一树脂层和第二树脂层。 第一树脂层和第二树脂层各自包含树脂组合物的固化物。 第一树脂层中的树脂组合物与第二树脂层中的树脂组合物不同。 包含在第二树脂层中的树脂组合物的固化产物的相对介电常数低于包含在第一树脂层中的树脂组合物的固化产物的相对介电常数。

公开(公告)号：US09736935B2

公开(公告)日：2017-08-15

申请号：US14446650

申请日：2014-07-30

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Shingo Yoshioka

IPC: B32B37/16 ,  B32B37/26 ,  C08L79/08 ,  H05K1/05 ,  H05K1/03 ,  C08L63/00 ,  C08J5/24 ,  C09D163/00 ,  C09D179/08 ,  C08G59/24 ,  C08G59/62

CPC classification number: H05K1/0373 ,  B32B2311/00 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2433/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/03 ,  C09D163/00 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/31529 ,  C08L33/08

Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

公开(公告)号：US20150075852A1

公开(公告)日：2015-03-19

申请号：US14389525

申请日：2014-03-11

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino ,  Takashi Hoshi

IPC: C09D163/04 ,  H05K1/02 ,  H05K1/05 ,  C09D163/00 ,  H05K1/03

CPC classification number: C09D163/04 ,  C08J5/24 ,  C08J2333/06 ,  C09D163/00 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract translation: 根据本发明的预浸料由树脂组合物和浸渍有树脂组合物的织物基材形成。 树脂组合物含有：（A）热固性树脂组合物; （B）Tg不高于100℃的树脂; 和（C）无机填料。 Tg不大于100℃的树脂（B）具有：羰基或硅氧烷基; 和环氧基或酚羟基。 无机填料（C）用由通式YSiX 3表示的硅烷偶联剂进行表面处理，其中X表示甲氧基或乙氧基，Y表示碳原子数为6〜18的脂肪族烷基。

公开(公告)号：US20140374142A1

公开(公告)日：2014-12-25

申请号：US14364914

申请日：2012-11-29

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/03 ,  H05K3/02 ,  H05K1/00

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract translation: 根据本实施例的覆金属层压板包括绝缘层和存在于绝缘层的至少一个表面侧上的金属层。 绝缘层是至少三层中心层，存在于中心层的一个表面侧的第一树脂层和存在于中心层的另一表面侧的第二树脂层的层压体。 中心层，第一树脂层和第二树脂层各自含有树脂组合物的固化物。 包含在第一树脂层和第二树脂层中的树脂组合物的固化产物的热膨胀系数小于包含在中心层中的树脂组合物的固化产物的热膨胀系数。

公开(公告)号：US20140367150A1

公开(公告)日：2014-12-18

申请号：US14355141

申请日：2013-09-19

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC classification number: H05K1/0271 ,  B32B15/14 ,  C08G59/621 ,  C08J5/24 ,  C08J2333/02 ,  C08J2363/00 ,  C08J2433/02 ,  C08L63/00 ,  C08L2205/02 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.

Abstract translation: 本公开内容涉及通过加热干燥浸渍有树脂组合物的织物基材形成的预浸料，直到树脂组合物处于半固化状态。 树脂组合物含有（A）具有萘骨架的环氧树脂和酚类固化剂中的至少一种; 和（B）具有由下式（I）和（II）表示的结构的聚合物，碳原子之间的不饱和键，环氧值为0.2至0.8 ep / kg，重均分子量为20万 至850,000：其中X：Y = 0：1至0.35：0.65，R1表示H或CH3，R2表示H或烷基。

公开(公告)号：US09661749B2

公开(公告)日：2017-05-23

申请号：US14364914

申请日：2012-11-29

Applicant: Panasonic Corporation

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  B32B15/12 ,  B32B15/14

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09102850B2

公开(公告)日：2015-08-11

申请号：US14389525

申请日：2014-03-11

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino ,  Takashi Hoshi

IPC: C09D163/04 ,  H05K1/02 ,  H05K1/05 ,  C08J5/24 ,  H05K1/03 ,  C09D163/00

CPC classification number: C09D163/04 ,  C08J5/24 ,  C08J2333/06 ,  C09D163/00 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract translation: 根据本发明的预浸料由树脂组合物和浸渍有树脂组合物的织物基材形成。 树脂组合物含有：（A）热固性树脂组合物; （B）Tg不高于100℃的树脂; 和（C）无机填料。 Tg不大于100℃的树脂（B）具有：羰基或硅氧烷基; 和环氧基或酚羟基。 无机填料（C）用由通式YSiX 3表示的硅烷偶联剂进行表面处理，其中X表示甲氧基或乙氧基，Y表示碳原子数为6〜18的脂肪族烷基。